Windowing structure for pressing dry film before plating of goldfinger of module board

Abstract

The invention discloses a windowing structure for pressing a dry film before the plating of a goldfinger of a module board, wherein a pad, a connecting circuit, through hole rings and a to-be-plated goldfinger are formed on the metal layer on the surface of the base board of the module board, the dry film is pressed and covered on the surface of the module board, the position of the dry film, which is positioned at the to-be-plated goldfinger, is windowed so as to expose the to-be-plated goldfinger, on the surface of the module board, except the through hole rings of a goldfinger, the connection circuit between the through holes of the goldfinger and the to-be-plated goldfinger and the position at the outer side of the surface the to-be-plated goldfinger, other rest positions are covered with solder resist ink, the windowing part of the dry film is extended to the through hole rings for exposing the goldfinger and the connection circuit between the through hole rings of the goldefinger and the to-be-plated goldfinger, so that the to-be-plated goldfinger, the through hole rings of the goldfinger as well as the connection circuit between the through hole rings of the goldfinger and the to-be-plated goldfinger are respectively plated with a golden layer, further, the appearance of the module board after the manufacture of the goldfinger is consistent, and the reject rate is greatly reduced.

Description

technical field [0001] The invention relates to a window opening structure for laminating a dry film before electroplating of a circuit board, in particular to a window opening structure for laminating a dry film before gold finger plating of a module board. Background technique [0002] In the production of the gold finger of the original module board (MODULE board), except for the exposed copper of the gold-plated finger part and the hole ring part of the gold finger via hole, the rest of the copper part is covered with solder resist ink. Before the gold-plated finger is gold-plated, The dry film is pressed on the surface of the module board to be plated. Since the potion is aggressive to the covered dry film when the gold finger is electroplated, part of it penetrates a small amount from the window of the dry film corresponding to the gold finger to be plated through the gap between the dry film and the surface of the module board. Apply some liquid medicine, and finally ...

AI Technical Summary

Problems solved by technology

[0002] In the production of the gold finger of the original module board (MODULE board), except for the exposed copper of the gold-plated finger part and the hole ring part of the gold finger via hole, the rest of the copper part is covered with solder resist ink. Before the gold-plated finger is gold-plated, The dry film is pressed on the surface of the module board to be plated. Since the potion is aggressive to the covered dry film wh

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