Substrate processing apparatus and method of manufacturing a semiconductor device

Abstract

A substrate processing apparatus includes a processing chamber in which a substrate is processed, a substrate holder configured to be loaded into and unloaded from the processing chamber while holding the substrate, a transfer chamber in which a charging operation for causing the substrate holder to hold an unprocessed substrate and a discharging operation for taking out a processed substrate from the substrate holder are performed, and a cleaning unit configured to blow clean air into the transfer chamber. The transfer chamber has a polygonal plan-view shape and includes corner areas. The cleaning unit is arranged in one of the corner areas of the transfer chamber.

Description

[0001] Cross References to Related Applications [0002] This application is based on and claims the benefit of priority from Japanese Patent Application No. 2010-223418 filed on October 1, 2010, the entire contents of which are hereby incorporated by reference. technical field [0003] The present disclosure relates to substrate processing apparatus and methods for manufacturing semiconductor devices. Background technique [0004] In general, a vertical substrate processing apparatus for use in semiconductor devices includes a transfer chamber arranged below a wafer processing chamber. During the manufacturing process, the following operations are performed: an operation of transferring unprocessed wafers into substrate holders (or wafer boats) to be loaded into a processing chamber (called a wafer loading operation) and transferring processed wafers from The operation of unloading the transfer from the substrate holder of the processing chamber (referred to as wafer unlo...

AI Technical Summary

Problems solved by technology

In particular, if the diameter of the wafer increases (for example, from 300mm to 450mm), then this will become a big problem

Images