Solid-state imaging device and manufacturing method thereof, and electronic apparatus

Abstract

A solid-state imaging device (1) includes a supporting substrate (3) that includes a concave portion (2), a solid-state imaging chip (4) that is bonded on the supporting substrate (3) so as to seal the concave portion (2) in a view-angle region, a stress film (5) that is formed on the surface of the solid-state imaging chip (4), and an imaging surface curved toward the concave portion (2) at least in the view-angle region.

Description

[0001] Cross References to Related Applications [0002] The present application contains subject matter related to the disclosure of Japanese Priority Patent Application JP 2010-260973 filed in the Japan Patent Office on Nov. 24, 2010, the entire content of which is hereby incorporated by reference. technical field [0003] The present invention relates to a solid-state imaging device, a method of manufacturing the same, and an electronic device such as a camera including the solid-state imaging device. Background technique [0004] As a solid-state imaging device (imaging sensor), a CMOS solid-state imaging device, a CCD solid-state imaging device, and the like are known. Such as Figure 39 As shown, a camera 161 using a solid-state imaging device generally includes a solid-state imaging device 162 formed in a flat plate shape and an imaging lens system 164 composed of a plurality of lenses 163 . When an imaging lens system images an object, a focus position deviates betw...

AI Technical Summary

Problems solved by technology

That is, when the semiconductor chip 167 is bent one by one, microfabrication is impossible, and the center P of the viewing angle area and the optical center Q of the lens are difficult to coincide with each other

Therefore, it is difficult to focus uniformly across the entire viewing angle area

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