Multifilament conductor and method for producing same
A multi-filament conductor and structure technology, applied in the manufacture/processing of superconductor devices, permanent superconductor devices, superconductive devices, etc.
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0043] FIG. 1 shows the layers perpendicular to the longitudinal axis of the multi-filament conductor 1 according to the prior art in an oblique view from the front of the multi-filament conductor 1 . The multifilament conductor 1 has a strip-shaped substrate 2 with a front side 9 and a rear side 10 . The first direction 21 of the tape-shaped substrate 2 is defined as the longitudinal direction of the tape-shaped substrate 2 . Strip-shaped parallel strips of the buffer layer 4 are applied parallel to the first direction 21 on the front side 9 of the strip-shaped substrate 2 . The strips of cushioning layer 4 are spaced apart from each other and have a second direction 22 corresponding to the longitudinal direction of the strips of cushioning layer 4 . On the strips of the buffer layer 4 a superconducting layer 3 is formed, for example of YBCO material. A thin silver layer (Ag layer) 5 a and a copper layer (Cu layer) 5 b are formed on the superconducting layer 3 as a protecti...
PUM
Property | Measurement | Unit |
---|---|---|
thickness | aaaaa | aaaaa |
width | aaaaa | aaaaa |
thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com