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Device and method for quickly controlling temperature of electrostatic chuck

An electrostatic chuck and fast technology, which is applied in the manufacture of circuits, electrical components, semiconductor/solid-state devices, etc., can solve the problems that the temperature control device and method of the electrostatic chuck are difficult to meet, and achieve the effect of rapid cooling

Active Publication Date: 2014-08-27
ADVANCED MICRO FAB EQUIP INC CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For this demand, the temperature control device and method of the electrostatic chuck in the prior art are difficult to meet

Method used

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  • Device and method for quickly controlling temperature of electrostatic chuck
  • Device and method for quickly controlling temperature of electrostatic chuck

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] figure 1 The device 1 for controlling the temperature of an electrostatic chuck provided in Embodiment 1 of the present invention includes:

[0043] An electrostatic chuck 11, the central area 111 (the area shown by the dotted line) and the edge area 112 of the electrostatic chuck 11 are respectively provided with heat exchange channels 1111, 1121;

[0044] The cooling liquid supply pipe 12 in the central area is used to supply cooling liquid to the heat exchange channel 1111 in the central area 111;

[0045] An edge area cooling liquid supply pipe 13 is used to supply cooling liquid to the heat exchange channel 1121 of the edge area 112;

[0046] three cooling devices 14;

[0047] switching means connecting the three cooling means 14 to the cooling liquid supply ducts 12, 13 of the central area 111 and the edge area 112,

[0048] The switching device can selectively connect the three cooling devices 14 with the cooling liquid supply pipes 12, 13 in the central area ...

Embodiment 2

[0064] figure 2 The device 2 for controlling the temperature of the electrostatic chuck provided in Embodiment 1 of the present invention includes:

[0065] An electrostatic chuck 11, the central area 111 (the area shown by the dotted line) and the edge area 112 of the electrostatic chuck 11 are respectively provided with heat exchange channels 1111, 1121;

[0066] The cooling liquid supply pipe 12 in the central area is used to supply cooling liquid to the heat exchange channel 1111 in the central area 111;

[0067] An edge area cooling liquid supply pipe 13 is used to supply cooling liquid to the heat exchange channel 1121 of the edge area 112;

[0068] Three cooling devices 14;

[0069] proportional switching means of the cooling liquid supply ducts 12, 13 connecting the three cooling means 14 to the central zone 111 and the edge zone 112;

[0070] The proportional switching device can selectively connect the three cooling devices 14 with the cooling liquid supply pipes...

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PUM

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Abstract

The invention relates to a device for quickly controlling temperature of an electrostatic chuck. The device comprises the electrostatic chuck which is provided with heat exchange channels on a central area and marginal areas, a central area cooling liquid supply pipeline which is used for supplying cooling liquid to the heat exchange channels of the central area, a marginal area cooling liquid supply pipeline which is used for supplying cooling liquid to the heat exchange channels of the marginal areas, a plurality of cooling devices, a switching device or a proportionally switching device for connecting the cooling devices to the cooling liquid supply pipelines on the central area and the marginal areas; and correspondingly, a heat exchange channel is used for selectively completely supplying cooling liquid flowing through the cooling devices to the heat exchange channels of the central area or the heat exchange channels of the marginal areas, or a heat exchange channel is used for proportionally supplying cooling liquid flowing through the cooling devices to the heat exchange channels of the central area or the heat exchange channels of the marginal areas. The invention also provides a method for quickly controlling the temperature of the electrostatic chuck. Due to the adoption of the technical scheme provided by the invention, the temperature of the electrostatic chuck can be quickly controlled.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a device and method for quickly controlling the temperature of an electrostatic chuck. Background technique [0002] Electrostatic Chucks (ESC) can be used to fix and support wafers in semiconductor manufacturing processes to prevent wafers from moving or misaligning during the process. Since the electrostatic chuck uses electrostatic force to hold the wafer, compared with the mechanical chuck or vacuum chuck used before, it can reduce the rupture due to mechanical pressure during use, and the electrostatic chuck increases the effective processing area. area and is suitable for operation in a vacuum environment. [0003] In the semiconductor process, the processing conditions required by the center area and the edge area of ​​the wafer are different, and the two areas often need to change the process conditions, such as temperature. Therefore, the center area and the e...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67H01L21/683
Inventor 凯文皮尔斯
Owner ADVANCED MICRO FAB EQUIP INC CHINA