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Adsorption spacer

A technology of adsorption pad and adsorption layer, which is applied to the field of adsorption pads with holes or grooves on the surface, which can solve the problems of reducing operating efficiency and long time

Inactive Publication Date: 2015-04-01
SAN FANG CHEM IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Although the adsorption pad 12 has sufficient adsorption capacity to adsorb the substrate 13, it takes a long time to remove the substrate 13 from the adsorption pad 12 after polishing.
Especially at present, the base material 13 is developing toward large size and thin thickness, and the difficulty of removing the base material 13 is increased, thereby reducing the working efficiency and increasing the fragmentation rate

Method used

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Examples

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Embodiment Construction

[0067] refer to figure 2 and image 3 , which shows a schematic diagram of the first embodiment of the manufacturing method of the adsorption pad of the present invention. First, refer to figure 2 , providing a gasket body 2 . The gasket body 2 has an upper surface 21 , a lower surface 22 and at least one side 23 . The gasket body 2 is made of foam material, and a plurality of foam holes (for example: first foam holes 241 and second foam holes 251 ) are formed inside the gasket body 2 during the foaming process. The upper surface 21 is used to adsorb a substrate 13 ( figure 1 ), and the lower surface 22 is used to be attached to a machine (such as figure 1on the lower platform 11). A plurality of foaming holes are located in the gasket body 2 and are interconnected holes, and some of the plurality of foaming holes are opened on the side surface 23 .

[0068] In this embodiment, the gasket body 2 is made of resin and has a double-layer structure. However, it can be un...

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Abstract

The invention relates to an adsorption spacer comprising a spacer body, wherein the spacer body is provided with an upper surface, a plurality of foaming holes and a plurality of surface holes or at least one groove; the upper surface is used for adsorbing a substrate; the plurality of foaming holes are located inside the spacer body; the plurality of surface holes or the groove are / is opened on the upper surface and are / is not communicated with the plurality of foaming holes; and the plurality of surface holes or the groove are / is formed by processing and arranged into at least one pattern. Therefore, the time of taking the substrate off the adsorption spacer can be shortened.

Description

technical field [0001] The invention relates to an adsorption gasket, in particular to an adsorption gasket with holes or grooves on the surface. Background technique [0002] Polishing generally refers to the abrasion control of the initially rough surface in the chemical mechanical polishing (CMP) manufacturing process. After grinding the pad, rub in repeated regular motions. The substrate is an object such as a semiconductor, a storage medium substrate, an integrated circuit, LCD flat glass, optical glass, and a photoelectric panel. During the polishing process, an adsorption pad must be used to support and fix the substrate, and the quality of the adsorption pad directly affects the polishing effect of the substrate. [0003] refer to figure 1 , showing a schematic diagram of a grinding device with a conventional adsorption pad disclosed in US Pat. No. 5,871,393. The grinding equipment 1 comprises a lower base plate (Lower Base Plate) 11, a suction pad (Sheet) 12, a ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B37/27
Inventor 冯崇智姚伊蓬王良光吴文杰刘玮得
Owner SAN FANG CHEM IND