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Transponder tagged object and method for manufacturing a transponder tagged object

一种标记对象、应答器的技术，应用在机器使用的记录载体、仪器、电气元件等方向，能够解决天线困难、不方便成本等问题，达到提高接收强度或质量、降低成本的效果

Active Publication Date: 2012-07-04
NXP BV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, it is difficult, inconvenient and costly to design, construct and manufacture these special antennas

Method used

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  • Transponder tagged object and method for manufacturing a transponder tagged object
  • Transponder tagged object and method for manufacturing a transponder tagged object
  • Transponder tagged object and method for manufacturing a transponder tagged object

Examples

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Embodiment Construction

[0039] The description in the drawings is schematic. In different drawings, similar or identical elements are provided with similar or identical reference signs.

[0040] figure 1 A cross-sectional view of a part of the transponder marking object 100 according to the embodiment is schematically shown. The object 102 includes a metal housing 101 that includes a first part 103 and a second part 105 spaced apart along a lateral direction 107, wherein the first part 103 and the second part 105 are separated from each other by an insulating area 109, the insulating area 109 In the illustrated embodiment, it has a slit shape, specifically a slit shape including an insulating material. Specifically, the first part 103 of the housing 101 is galvanically isolated from the second part 105 of the housing 101 by the insulating area 109.

[0041] The transponder tag 111 is attached to the surface 113 of the housing 101 of the subject. The transponder label includes a dielectric substrate or ...

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PUM

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Abstract

It is described a transponder tagged object, comprising: a conductive structure (103, 105, 403, 405); an insulating region (109, 409) galvanically isolating a first portion (103, 403) of the conductive structure from a second portion (105, 405) of the conductive structure; and a transponder tag (111, 411, 611) comprising a first antenna pad (133, 333) and a second antenna pad (135, 335), wherein the transponder tag is fixed at the object such that the first portion of the conductive structure in particular capacitively couples to the first antenna pad and such that the second portion of the conductive structure in particular capacitively couples to the second antenna pad. Further, a method for manufacturing a transponder tagged object is described.

Description

Technical field [0001] The invention relates to a transponder tagged object and a method for manufacturing a transponder tagged object. Specifically, the present invention relates to a transponder tag object and a method of manufacturing a transponder tag object, wherein a part of the object is capacitively coupled to a transponder tag to allow the transponder tag to communicate with a reader. In addition, in particular, the present invention relates to a transponder marking object and a method of manufacturing a transponder marking object, wherein the transponder tag works with an electromagnetic gap antenna or an electromagnetic band gap antenna. Background technique [0002] US 2007 / 0017986 A1 discloses a technology for a radio frequency identification (RFID) device, wherein the device includes a slot antenna having at least one slot arranged in a first substrate . A strap arranged across the slit includes a second substrate and an integrated circuit. The integrated circuit...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06K19/077
CPCG06K19/07749H01Q1/2225Y10T29/49117
Inventor 格柳利尔诺·曼茨
Owner NXP BV