One-component epoxy encapsulating adhesive with good rheological stability and preparation method thereof

A single-component, epoxy-encapsulated technology, applied in the direction of epoxy resin adhesives, adhesives, adhesive types, etc., can solve problems such as changes in the rheological properties of the adhesive, exceeding the encapsulation range, and easy flow, etc., to achieve low elasticity modulus, reducing waste of resources, and reducing the effect of rework costs

Inactive Publication Date: 2012-07-11
BEIJING HYSTIC NEW MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The rheological properties of the glue change, causing the glue to flow easily when sizing on a hot table, exceeding the encapsulation range and causing pollution

Method used

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  • One-component epoxy encapsulating adhesive with good rheological stability and preparation method thereof
  • One-component epoxy encapsulating adhesive with good rheological stability and preparation method thereof
  • One-component epoxy encapsulating adhesive with good rheological stability and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031]

[0032] Preparation method: Accurately weigh various raw materials according to the proportion of the above formula, first add epoxy resin, active diluent, and stabilizer to the reaction kettle in sequence, stir evenly under vacuum, then add fillers and pigments, after stirring evenly under vacuum, Add latent curing agent, disperse evenly, and carry out vacuum defoaming treatment.

Embodiment 2

[0034]

[0035]

[0036] Preparation method: Accurately weigh various raw materials according to the proportion of the above formula, first add epoxy resin, active diluent, and stabilizer to the reaction kettle in sequence, stir evenly under vacuum, then add fillers and pigments, after stirring evenly under vacuum, Add latent curing agent, disperse evenly, and carry out vacuum defoaming treatment.

[0037] The embodiment listed in Table 1 and its curing characteristics and storage performance test results show that: the encapsulant of the present invention has low coefficient of linear thermal expansion, low modulus of elasticity, high bonding strength, good rheological stability, and long storage time. Convenience in production, use and storage.

[0038] Table 1

[0039]

[0040] The invention solves the rheological stability problem of storage at room temperature, adding cyanate ester stabilizers to the formula, and using the principle of addition of cyanate ester...

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Abstract

The invention discloses a one-component epoxy encapsulating adhesive with good rheological stability and a preparation method thereof. The one-component epoxy encapsulating adhesive is characterized in that the adhesive comprises the following components in parts by weight: 30-45 parts of epoxy resin, 5-15 parts of epoxy diluent, 5-10 parts of latent curing agent, 0.5-2.0 parts of stabilizer, 40-50 parts of filler and 0.1-1.0 part of pigment; and the method comprises the following steps: (a) adding the epoxy resin, active diluent and stabilizer in a reaction kettle in turn, and stirring evenly under vacuum; (b) adding the filler and pigment in the mixture, and stirring evenly under vacuum; and (c) adding the latent curing agent in the mixture, stirring evenly under vacuum and performing vacuum debubbling treatment.

Description

technical field [0001] The invention relates to an adhesive, in particular to a one-component epoxy encapsulating adhesive with good rheological stability and a preparation method. The encapsulating adhesive is stored at room temperature and is used for encapsulating chips in the electronic industry. Background technique [0002] Chip on board (COB) is a typical manufacturing technology between packaging and assembly. The bare chip is directly mounted on the printed circuit board instead of being "packaged" and then assembled to the printed circuit board. superior. The COB manufacturing process is similar to the traditional bare chip packaging, except that the package substrate is replaced by a conventional printed circuit board, and the bare chip is directly connected to the circuit by wire bonding, tape or flip chip. In order to protect the bare chip from the environment and prevent damage to the chip and connecting wires, it is necessary to encapsulate the chip and bondi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/02C09J11/06
Inventor 李建华
Owner BEIJING HYSTIC NEW MATERIALS
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