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Heat conduction glue detection test device and design method thereof

A technique for testing and designing methods

Inactive Publication Date: 2012-07-11
XIAN KAIRONG ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, there are very few test devices for testing the performance parameters of thermal conductive adhesives in the market. When testing the performance parameters of different types of thermal conductive adhesives, it is necessary to test item by item. The testing process is complicated, with large errors, low efficiency and high cost.

Method used

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  • Heat conduction glue detection test device and design method thereof
  • Heat conduction glue detection test device and design method thereof

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Experimental program
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Embodiment 1

[0017] Embodiment 1 This heat-conducting adhesive detection and testing device is characterized in that it includes a heat-conducting plate 2, a heat source, a temperature detection controller 8, a first temperature sensor 9 and a second temperature sensor 10, and the first temperature sensor 9 is fixed on the heat-conducting plate In the inner groove of 2, the heat conduction plate 2 is supported by the heat conduction support bracket 3, and the heat conduction glue sample 1 can be placed on the heat conduction plate 2. There is a second temperature sensor 10 directly above, and the second temperature sensor 10 and the first temperature sensor 9 are electrically connected with the temperature detection and control instrument 8 .

Embodiment 2

[0018] Embodiment 2 As shown in Figure 1, this heat-conducting glue detection test device, it comprises heat-conducting plate 2, far-infrared heat source 4, temperature detection controller 8, first temperature sensor 9 and second temperature sensor 10, the first temperature sensor 9 is fixed in the heat conduction plate 2, the heat conduction plate 2 is supported by the heat conduction support bracket 3, the heat conduction glue sample 1 is placed on the upper end of the heat conduction plate 2, and the far infrared heat source 4 is fixed in the heat conduction support bracket 3, so that the far infrared heat source 4 and the heat conduction The board 2 is within a fixed interval, and the far-infrared heat source 4 is electrically connected to the 220V / 50Hz AC power supply 6 through the voltage regulating device 5. There is a second temperature sensor 10 on the upper end of the heat-conducting adhesive sample 1, and the second temperature sensor 10 is fixed on the second On th...

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Abstract

The invention relates to a heat conduction glue detection test device and a design method of the device; the heat conduction glue detection test device is characterized in that a first temperature sensor (9) of the device is fixed in a groove in a heat conduction plate (2) which is supported by a heat conduction bracket (3); a heat conduction glue sample piece (1) can be arranged on the heat conduction plate (2); the heat conduction bracket (3) is internally and fixedly provided with a heat source; a second temperature sensor (10) is arranged just above the upper surface of the heat conduction glue sample piece (1); the second temperature sensor (10) and the first temperature sensor (9) are electrically connected with a temperature detection controller (8); a power supply is powered on during measurement, the temperature of the heat conduction plate (2) is constant at 80 DEG C, the temperature of the upper surface of a glue sample measured by the second temperature sensor (10) is read by the temperature detection controller (8) every five minutes, and the read temperature values are recorded. The heat conduction glue detection test device designed by the method is high in practicability, low in cost, safe in operation, convenient to disassemble, convenient to carry and accurate in measurement for the performance of heat conduction glue.

Description

technical field [0001] The invention relates to the field of measurement technology, in particular to a heat-conducting glue detection and testing device and a design method thereof. Background technique [0002] In recent years, with the rapid development of the power electronics industry, in addition to the continued growth of thermal conductive adhesive products, great changes have also taken place in the demand for variety structure, which also puts forward higher requirements for the testing of thermal conductive adhesive performance parameters. It not only requires testing equipment to accurately measure the performance of thermally conductive adhesives, but also requires that various types of thermally conductive adhesives can be tested, and most importantly, it proposes a higher technology for the safety, efficiency, and accuracy of the test. Require. At present, there are very few test devices for testing the performance parameters of thermal conductive adhesives i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N25/20
Inventor 邱扬杜建华
Owner XIAN KAIRONG ELECTRONICS TECH