Packaging structure of light-emitting diode
A light-emitting diode and packaging structure technology, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of complex manufacturing process, reduced reliability of light-emitting diode packaging structure, poor bonding force, etc., and achieve the effect of simple and reliable structure
Inactive Publication Date: 2012-07-11
ZHANJING TECH SHENZHEN +1
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Problems solved by technology
However, in the prior art, the reflective cup is often made of plastic material, which causes the LED packaging structure to generate an unnecessary specific light field and affects the optical characteristics of the LED packaging structure
In addition, the reflection cup and the electrodes are respectively fixed on the substrate, the manufacturing process is complicated, and because of the poor bonding force between the reflection cup, the electrode and the substrate, the reliability of the LED packaging structure is reduced, which directly affects the reliability of the LED packaging structure. service life
Method used
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[0031] see Figure 1 to Figure 3 The light emitting diode packaging structure 10 provided by an embodiment of the present invention includes a support 20, a first electrode 30 and a second electrode 40 embedded in the support 20, a light emitting diode chip 50 arranged on the first electrode 30, and a packaged light emitting diode chip 50. The encapsulation layer 60 of the diode chip 50 .
[0032] The bracket 20 is arranged in a rectangular shape, and can be adjusted accordingly in other embodiments according to specific requirements. The bracket 20 is made of a material with high thermal conductivity and insulation, such as polymer compound, silicon or ceramics. The bracket 20 has a first surface 21 and a second surface 22 opposite to the first surface 21 . The middle part of the bracket 20 is provided with an accommodating groove (not shown in the figure) for disposing the LED chip 50 and the encapsulation layer 60 .
[0033] The first electrode 30 is integrally made of m...
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A packaging structure of a light-emitting diode comprises a support, a first electrode, a second electrode and a light-emitting diode chip, wherein the first electrode, the second electrode and the light-emitting diode chip are arranged on the support. The first electrode comprises an electrode portion and a reflection portion integrally connected with the electrode portion, the second electrode comprises an electrode portion and a reflection portion integrally connected with the electrode portion, the light-emitting diode chip is respectively and electrically connected with the electrode portion of the first electrode and the electrode portion of the second electrode, and the reflection portion of the first electrode and the reflection portion of the second electrode jointly surround the light-emitting diode chip to reflect light emitted by the light-emitting diode chip back. The packaging structure of the light-emitting diode uses the reflection portion of the first electrode and the reflection portion of the second electrode as a reflection cup to reflect the light emitted by the light-emitting diode chip back, and the packaging structure is simple and reliable in structure.
Description
technical field [0001] The invention relates to a packaging structure, in particular to a packaging structure of a light emitting diode. Background technique [0002] Compared with the traditional light source, light emitting diode (Light Emitting Diode, LED) has the advantages of light weight, small size, low pollution, long life, etc. As a new type of light source, it has been more and more applied to In various fields, such as street lights, traffic lights, signal lights, spotlights and decorative lights, etc. [0003] A common LED packaging structure generally includes a substrate, electrodes disposed on the substrate, a LED chip, and a reflective cup surrounding the LED chip. However, in the prior art, the reflective cup is usually made of plastic material, so that the LED packaging structure generates an unnecessary specific light field, which affects the optical characteristics of the LED packaging structure. In addition, the reflection cup and the electrodes are re...
Claims
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IPC IPC(8): H01L33/48H01L33/62H01L33/60
Inventor 张耀祖简克伟
Owner ZHANJING TECH SHENZHEN