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Printed circuit board

A printed circuit board, electrical technology, applied in the direction of printed circuit components, electrical connection of printed components, etc., can solve the problems of affecting the quality of signal transmission and increasing the workload of wiring

Inactive Publication Date: 2012-07-11
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When wiring the differential signals on the circuit board with polarity exchange, the usual method is to connect a pair of differential signal lines 3 on one signal layer to the differential signal lines 2 on the other signal layer through the through hole 1 That is, the positive differential signal line 31 of this signal layer is connected to the negative differential signal line 22 of another signal layer through one of the through holes 1, and the negative differential signal line 32 of this signal layer is connected to another through hole 1. The positive differential signal line 21 of the signal layer, but this method often meets the requirement of equal length of the differential signal line, such as figure 1 The displayed situation is that one of the differential signal lines 21 needs to be wired in a curved shape so that the differential signal line 21 is equal to the other differential signal line 22, which not only increases the workload of wiring, but also affects the quality of signal transmission

Method used

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  • Printed circuit board
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Embodiment Construction

[0027] Please refer to figure 2 A preferred embodiment of the printed circuit board 100 of the present invention includes a first signal layer 10 , a second signal layer 30 and a dielectric layer 20 disposed between the first and second signal layers 10 and 30 . The first signal layer 10 is provided with a first pair of differential signal transmission lines 12 . A second pair of differential signal transmission lines 32 is disposed on the second signal layer 30 . The first pair of differential signal transmission lines 12 includes a first positive differential signal transmission line 122 and a first negative differential signal transmission line 124 . The second differential signal transmission line 32 includes a second positive differential signal transmission line 322 and a second negative differential signal transmission line 324 . The first positive differential signal transmission line 122 is electrically connected to the second negative differential signal transmiss...

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Abstract

A printed circuit board comprises a first signal layer and a second signal layer. A first pair of difference signal transmission lines are arranged on the first signal layer; a second pair of difference signal transmission lines are arranged on the second signal layer; the first pair of difference signal transmission lines comprise a first positive pole difference signal transmission line and a negative pole difference signal transmission line; the second pair of the difference signal transmission lines comprise a second positive pole difference signal transmission line and a second negative pole difference signal transmission line; the first positive pole difference signal transmission line is electrically connected with the second negative pole difference signal transmission line via a first through-hole; the first negative difference signal transmission line is electrically connected with the second positive difference transmission line via a second through-hole; and the central line of the first and the second through-holes form an acute angle with the surface of the printed circuit board. By adopting the printed circuit board provided by the invention, the wiring workload of the difference signal transmission line is lowered.

Description

technical field [0001] The invention relates to a printed circuit board. Background technique [0002] In order to connect the traces between different layers, through holes are usually provided between the layers of the printed circuit board. Currently, the through holes 1 designed between the two layers are perpendicular to each layer (see figure 1 ). When wiring the differential signals on the circuit board with polarity exchange, the usual method is to connect a pair of differential signal lines 3 on one signal layer to the differential signal lines 2 on the other signal layer through the through hole 1 That is, the positive differential signal line 31 of this signal layer is connected to the negative differential signal line 22 of another signal layer through one of the through holes 1, and the negative differential signal line 32 of this signal layer is connected to another through hole 1. The positive differential signal line 21 of the signal layer, but this method ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K1/11
Inventor 陈永杰许寿国
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD