Circuit board structure of mobile electronic product and manufacturing method thereof

Abstract

The invention relates to a circuit board structure of a mobile electronic product and a manufacturing method thereof. The circuit board structure structurally comprises a flexible circuit board and a heat dissipating unit. In the manufacturing process of the circuit board structure, a first insulating layer is laminated with a copper layer; a circuit layout zone is formed on the copper layer; a second insulating layer is adhered onto the circuit layout zone, so that connecting interfaces and contact points are respectively formed at both ends of the circuit layout zone; a perforated hole is arranged between the contact points to form the flexible circuit board; a bump is arranged on a copper material to form the heat dissipating unit; the bump is correspondingly arranged in the perforated hole; a third insulating layer is arranged between the first insulating layer and the heat dissipating unit; and finally, a projection mechanism is electrically connected with the contact points and the bottom surface of the projection mechanism is contacted with the bump. Therefore, the requirements for thinning and bending can be met, so that the circuit board structure is easy to assemble in an inner space of the mobile electronic product and the requirement of according with the assembly of various mobile electronic products is met.

Description

technical field [0001] The present invention relates to a circuit board structure of a mobile electronic product and a manufacturing method thereof, in particular to a flexible circuit board and a cooling unit that can be thinned and designed so that it can be easily assembled in the internal space of a mobile electronic product. To achieve the effect of being able to assemble various mobile electronic products. Background technique [0002] The circuit board structure of commonly used mobile electronic products4 (such as Figure 12 ), which consists of a rigid circuit board 41, a projection mechanism 42 electrically connected to the rigid circuit board 41, and a connection interface 43 electrically connected to the rigid circuit board 41; thereby, The projection structure 4 is combined inside the mobile electronic product and electrically connected, so that the mobile electronic product uses the projection structure 4 to produce a projection effect. [0003] But because th...

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Problems solved by technology

[0003] But because this connection interface 43 has a predetermined height, so after this connection interface 43 is arranged on the hard circuit board 41, can make projection structure 4 can't reach the thin design because of connection interface 43, and because this projection structure The hard circuit board 41 of 4 cannot be bent, so when the projection structure 4 is assembled in the internal space of mobile electronic products, it often interferes with the internal space of mobile electronic products due to the raised connection interface 43, and also It is impossible to bend the hard circuit board 41 for the internal space, so that the mechanism design of the housing of the mobile electronic product must be changed during actual use, causing troubles in actual use

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