Circuit board structure of mobile electronic product and manufacturing method thereof

Abstract

The invention relates to a circuit board structure of a mobile electronic product and a manufacturing method thereof. The circuit board structure structurally comprises a flexible circuit board and a heat dissipating unit. In the manufacturing process of the circuit board structure, a first insulating layer is laminated with a copper layer; a circuit layout zone is formed on the copper layer; a second insulating layer is adhered onto the circuit layout zone, so that connecting interfaces and contact points are respectively formed at both ends of the circuit layout zone; a perforated hole is arranged between the contact points to form the flexible circuit board; a bump is arranged on a copper material to form the heat dissipating unit; the bump is correspondingly arranged in the perforated hole; a third insulating layer is arranged between the first insulating layer and the heat dissipating unit; and finally, a projection mechanism is electrically connected with the contact points and the bottom surface of the projection mechanism is contacted with the bump. Therefore, the requirements for thinning and bending can be met, so that the circuit board structure is easy to assemble in an inner space of the mobile electronic product and the requirement of according with the assembly of various mobile electronic products is met.

Description

technical field [0001] The present invention relates to a circuit board structure of a mobile electronic product and a manufacturing method thereof, in particular to a flexible circuit board and a cooling unit that can be thinned and designed so that it can be easily assembled in the internal space of a mobile electronic product. To achieve the effect of being able to assemble various mobile electronic products. Background technique [0002] The commonly used circuit board structure 4 of mobile electronic products (as shown in Figure 12) consists of a hard circuit board 41, a projection mechanism 42 electrically connected to the hard circuit board 41, and a hard circuit board 42 electrically connected to the hard circuit board. The connecting interface 43 on the printed circuit board 41 is formed; thereby, the projection structure 4 can be integrated in the mobile electronic product and electrically connected, so that the mobile electronic product can use the projection stru...

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Problems solved by technology

[0003] However, since the connection interface 43 has a predetermined height, when the connection interface 43 is arranged on the hard circuit board 41, the projection structure 4 cannot achieve a thinner design due to the connection interface 43, and because the projection structure 4 of the rigid circuit board 41 cannot be bent, therefore, when the projection structure 4 is assembled in the internal space of the mobile electronic product, it often interferes with the internal space of the mobile electronic product due to the raised connection interface 43, and also It is impossible to bend the hard circuit board 41 according to the internal space, so that the mechanism design of the housing of the mobile electronic product must be changed in actual use, causing troubles in actual use

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