Solder paste packaging equipment
A technology of packaging equipment and solder paste, applied in the field of packaging equipment, can solve the problems of inability to realize automation, low efficiency, and inability to guarantee the quantity of syringes, etc.
Active Publication Date: 2013-12-18
YIK SHING TAT INDUSTRIALCO LTD +1
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- Description
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Problems solved by technology
[0002] Existing solder paste is generally loaded with a syringe. When the solder paste is injected into the syringe, it is injected manually. It is impossible to guarantee the quantification of each syringe, and the efficiency is low, and automation cannot be realized at all.
Method used
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Embodiment Construction
[0022] The present invention provides a solder paste packaging equipment. In order to make the purpose, technical solution and effect of the present invention more clear and definite, the present invention will be further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.
[0023] Such as figure 1 As shown, the present invention is a solder paste packaging equipment, including a main cylinder 20 for storing and injecting solder paste 2, a feed cylinder 5 for controlling the injection of solder paste 2 into the main cylinder, and a feeding cylinder 5 for controlling solder paste 2 The discharge cylinder 8, the air compressor 13, and the controller 15 output from the master cylinder. The master cylinder 20 specifically includes a first master cylinder 11 and a second master cylinder 14, the feed...
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The invention discloses solder paste packaging equipment, which comprises a main cylinder, a feed cylinder, a discharge cylinder, an air compressor and a controller. A first infrared sensor is disposed in the main cylinder. The feed cylinder is connected with the main cylinder. The discharge cylinder is connected with the main cylinder. The air compressor is connected with the main cylinder, the feed cylinder and the discharge cylinder. The controller is connected with the first infrared sensor, a second infrared sensor and an air compressor. Solder paste is injected into the main cylinder by self-weight of solder paste, a pressure plate unit or the like, and the air compressor controls a valve of the feed cylinder to open and valves of the discharge cylinder and the main cylinder to close. When the amount of the input solder paste reaches a certain degree, the controller monitors the amount of the solder paste discharged to the feed cylinder through the first infrared sensor in the main cylinder, and input of the solder paste into the feed cylinder is cut off through the air compressor. When the solder paste in the discharge cylinder reaches a certain amount, discharge is stopped. The cycle is repeated so, so that automatic packaging of the solder paste is achieved.
Description
technical field [0001] The invention relates to packaging equipment, in particular to a solder paste packaging equipment. Background technique [0002] Existing solder paste is generally loaded with a syringe. When the solder paste is injected into the syringe, it is injected manually, which can not guarantee the quantity of each syringe, and the efficiency is low, and automation cannot be realized at all. [0003] Therefore, the prior art needs to be improved. Contents of the invention [0004] The object of the present invention is to provide an automatic solder paste packaging equipment. [0005] Technical scheme of the present invention is as follows: [0006] A solder paste packaging equipment, including: [0007] A main cylinder for storing solder paste, the first infrared sensor for monitoring the output of solder paste is arranged on the main cylinder; [0008] A feeding cylinder for controlling the injection of solder paste into the main cylinder, the feeding ...
Claims
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IPC IPC(8): B65B3/14B65B57/14
Inventor 徐金华周华郭云忠马鑫周长虹吴建新
Owner YIK SHING TAT INDUSTRIALCO LTD