Semiconductor device, method of manufacturing semiconductor device, and electronic device
A technology of semiconductors and electronic components, which is applied in semiconductor/solid-state device manufacturing, semiconductor devices, semiconductor/solid-state device components, etc., and can solve problems such as connection failures and prominent electrode displacements
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example 1
[0214] A semiconductor element having a size of 3.5 mm×7 mm (hereinafter referred to as “first semiconductor element”) on which protruding electrodes were formed was prepared. The protruding electrodes each included a Cu pillar portion having a diameter of 30 μm and a height of 35 μm, and tin-silver (SnAg) solder formed on the tip of the pillar to a height of 10 μm, and were arranged at a pitch of 50 μm.
[0215] Further, a base substrate made of Si having a size of 15 mm×15 mm (hereinafter referred to as “Si base substrate”) on which protruding electrodes were formed was prepared. The protruding electrodes have the same size and structure as the first semiconductor element, and are arranged in the same pattern as the first semiconductor element.
[0216] In addition, a Si substrate having no active layer was used as a semiconductor element having via holes (hereinafter referred to as "second semiconductor element"). The second semiconductor element was formed as follows. Fi...
example 2
[0221] A base substrate made of resin having a size of 35 mm×35 mm (hereinafter referred to as “resin base substrate”) on which protruding electrodes were formed was prepared. The protruding electrodes have the same size and structure as the first semiconductor element and are arranged in the same pattern as the first semiconductor element. The above-mentioned first semiconductor element is mounted on the resin base substrate using the above-mentioned second semiconductor element.
[0222] To do so, first, the second semiconductor element formed with through holes is mounted on the resin base substrate using a flip chip bonder so that the through holes of the second semiconductor element and the protruding electrodes of the resin base substrate are aligned. Next, the protruding electrodes of the first semiconductor element and the through holes of the second semiconductor element are aligned, and the first semiconductor element is mounted using a flip chip bonder. Subsequentl...
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