Nail polish pen
A technology of nail polish and pen tips, which is applied to the types of packaging items, applications, special packaging items, etc., which can solve problems such as inappropriate application and achieve the effect of avoiding uneven application
Inactive Publication Date: 2012-08-22
刘凤娥
View PDF0 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0003] Generally, the nail polish on the market is applied by a brush when the dye is applied. Users often apply it beyond the surface area of the nail because the bristles are bifurcated; and when the bristles are excessively stained with dye and absorb too much, resulting in inappropriate application the shape of
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
specific Embodiment approach
[0013] Such as figure 1 Shows a specific embodiment of the present invention: a nail polish pen, including a nail polish container 1, the end of the nail polish container 1 is connected with a replacement module 3, the replacement module 3 is provided with a spherical The nib 2 and the replacement module 3 can be taken away from the nail polish container 1 by rotating or pulling out.
[0014] The beneficial effects of the present invention are: the nail polish container 1 is provided with a replacement module 3, the nib can be replaced as required, and the uneven application caused by the easy bifurcation of the brush or excessive dyeing is avoided during use. Phenomenon.
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention discloses a nail polish pen, which comprises a nail polish container. The end of the nail polish container is connected with a replacement module, a spherical pen point is arranged on the replacement module, and the replacement module is connected with the nail polish container in a rotary mode or a pulling-out mode. The nail polish pen has the advantages that the nail polish container is provided with the replacement module, the pen point can be replaced according to the requirements, and a phenomenon of uneven daubing caused by the fact that a hairbrush is easily split or taken dye is two much is avoided in the using process.
Description
[0001] technical field [0002] The invention relates to a nail polish pen. Background technique [0003] Generally, the nail polish on the market is applied by a brush when the dye is applied. Users often apply it beyond the surface area of the nail because the bristles are bifurcated; and when the bristles are excessively stained with dye and absorb too much, resulting in inappropriate application shape is produced. Contents of the invention [0004] In order to overcome the above defects, the present invention provides a nail polish pen, which can improve the inconvenience caused by the shape of the hair brush. [0005] The technical solution adopted by the present invention in order to solve the technical problem is: a nail polish pen, comprising a nail polish container, the end of the nail polish container is connected with a replacement module, and the replacement module is provided with a spherical pen tip . [0006] As a further improvement of the present inve...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More IPC IPC(8): A45D34/04
Inventor 刘凤娥
Owner 刘凤娥
