Printed circuit board and method of manufacturing the same

Abstract

A structure of a printed circuit board and a method of manufacturing the same are provided. The manufacturing method includes a first step of forming at least one connecting bump on first circuit patterns and forming a first insulating layer to form an inner circuit board, a second step of processing a second insulating layer with a metal seed layer formed thereon using a mold to form second circuit patterns so as to construct an outer circuit board, and a third step of aligning the inner circuit board and the outer circuit board with each other and laminating the inner circuit board and the outer circuit board. Accordingly, a structure of a high-density high-reliability printed circuit board having a circuit embedded in an insulating layer can be provided. A seed layer forming process for forming an outmost circuit can be removed by using an insulating layer combined with a seed layer. In addition, a conductive structure in the form of a connecting bump is formed, and thus a complicated process of forming a via-hole and filling the via-hole with a conductive material is not required. Furthermore, a process of grinding the surface of the filled conductive material is removed so as to remarkably decrease a circuit error rate.

Description

technical field [0001] The invention relates to a printed circuit board with an embedded outer layer circuit pattern and a manufacturing method thereof. Background technique [0002] The technology of embedding vias and patterns in insulating layers has been widely used to improve the reliability of high-density patterns. There are two methods of manufacturing embedded printed circuit boards. The first method first forms a circuit pattern, embeds the circuit pattern in an insulating layer and removes a seed layer used to form the circuit pattern to obtain a final circuit. The second method makes a mold with a positive pattern corresponding to the shape of the circuit; uses the mold to form a negative pattern in the insulating layer; fills the negative pattern with a conductive material, and grinds the surface of the insulating layer to achieve the final circuit. [0003] figure 1 The aforementioned methods of forming a circuit pattern and embedding the circuit pattern in ...

AI Technical Summary

Problems solved by technology

[0007] However, this method requires advanced techniques to use a mold to create a negative pattern and fill it with a conductive material

Therefore, the manufacturing process is inefficient and time consuming

In addition, surface grinding is necessary, so the accuracy of the circuit is reduced

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