Semiconductor chip and method for manufacturing the same

Abstract

A semiconductor chip includes a substrate having a front surface and a back surface opposite the front surface, a conductive column part passing through the substrate from the front surface to the back surface, a cavity formed by removing a part of the back surface around an end portion of the conductive column part such that the end portion of the conductive column part protrudes from the cavity, a first insulation layer formed in the cavity such that a portion of the end portion of the conductive column part is exposed, and a back electrode electrically connected to the exposed end portion of the conductive column part.

Description

technical field [0001] Exemplary embodiments of the present invention relate to a semiconductor chip and a manufacturing method thereof, and more particularly, to a semiconductor chip capable of being used in an electronic product and a manufacturing method including forming silicon vias (TSVs), the electronic product having light weight , slim structure and compact size. Background technique [0002] As higher performance electronic products are made in a smaller size and the demand for portable mobile products increases, there is an increasing demand for ultra-miniature semiconductor memories with high capacity. In general, to increase the storage capacity of a semiconductor memory, a method of increasing the storage capacity of a semiconductor memory by increasing the degree of integration of semiconductor chips and a method of mounting and combining a plurality of semiconductor chips in one semiconductor package may be employed. In the former case, a lot of effort, cost...

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However, such equipment is expensive, resulting in increased product cost

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