Composite anodic bonding method
An anodic bonding and composite anode technology, which is used in precision positioning equipment, microstructure technology, microstructure devices, etc., can solve the problems that restrict the wide application of interface activation composite anode bonding process, strict wet chemical activation process conditions, and bonding efficiency. Low-temperature and other problems, to achieve the effect of low-temperature high-efficiency anodic bonding, good controllability of bonding performance, and convenient operation
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[0034] In the prior art, conventional anodic bonding has low bonding efficiency. During the bonding process of silicon / glass, the high temperature will cause the gas in the micropores of the glass to expand, decompose, and overflow, forming a gas layer at the bonding interface. If the gas is not discharged smoothly, hole defects will be formed on the interface. At present, point electrodes and multi-point electrodes are widely used in wafer-level bonding. When this type of electrode is used, the distribution of the external electric field on the bonding interface is uneven, and the bonding can only be gradually advanced from the electrode position to the edge. It takes a long time to complete the bonding of the whole chip, and the bonding efficiency is low.
[0035] At present, the step-by-step pretreatment anodic bonding equipment used in the existing technology is complicated, and the process is difficult to realize; moreover, the two processes of pretreatment and bonding a...
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