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Composite anodic bonding system and method based on multi-energy field coupling

An anodic bonding and composite technology, which is applied in the photoengraving process of the pattern surface, precision positioning equipment, microstructure technology and other directions, which can solve the problems of strict wet chemical activation process conditions, low bonding efficiency and poor controllability. , to achieve the effect of strengthening the pretreatment discharge effect, promoting the bonding effect, and improving the bonding quality

Active Publication Date: 2014-01-22
SUZHOU UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, high temperature makes anodic bonding prone to the following problems: First, the bonding efficiency is low
However, the current plasma activation environment conditions are strict and require special expensive plasma equipment. The process conditions of wet chemical activation are strict and the process is complicated, resulting in the problems of complex process and poor controllability of these activation methods, which restrict the interface activation composite anodic bonding. Wide application of technology

Method used

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  • Composite anodic bonding system and method based on multi-energy field coupling
  • Composite anodic bonding system and method based on multi-energy field coupling
  • Composite anodic bonding system and method based on multi-energy field coupling

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Embodiment Construction

[0038] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present invention.

[0039] ginseng figure 1 As shown, a kind of composite anodic bonding system based on multi-energy field coupling of the present invention includes:

[0040] A workbench, the workbench includes a first electrode 11 and a second electrode 12 arranged in parallel, and the first electrode 11 and the second electrode 12 are respectively used to place a glass device and a silicon device;

[0041] The power supply module 20 is electrically connec...

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Abstract

The invention discloses a composite anodic bonding system and a composite anodic bonding method based on multi-energy field coupling. The system comprises a workbench, a power source module, an electromagnetic induction heating device, and a driving device. The workbench comprises a first electrode and a second electrode which are arranged in parallel. The first electrode and the second electrode are respectively used for placing a glass device and a silicon device. The two ends of the power source module are respectively electrically connected with the first electrode and the second electrode. The electromagnetic induction heating device is arranged below the second electrode and is used for carrying out electromagnetic strengthening upon discharge pretreatment and anodic bonding. The driving device is connected on the first electrode and is used for driving the first electrode to move up and down. The entire structure of the system is simple, and is easy to integrate. Electromagnetic induction heating, pretreatment discharge and anodic bonding are integrally controlled. Regulation is simple. The entire composite bonding process is easy to realize, the parameters are easy to adjust, and bonding performance controllability is good.

Description

technical field [0001] The invention relates to the technical field of anodic bonding, in particular to a composite anodic bonding system and method based on multi-energy field coupling. Background technique [0002] Anode bonding technology plays an important role in the production, assembly, packaging and other links of MEMS devices. It is the core technology connecting various silicon processing technologies and the basic means to realize complex MEMS structures such as three-dimensional intersecting structures and multi-layer structures. one. At present, anodic bonding is realized by high temperature (400-500°C) and high voltage (1000-2000V). Physical and chemical reactions occur at the joint interface, which promotes the opening and closing of the chemical bonds formed by -OH, -O, -H, -Si, etc., and re-forms new chemical bonds such as Si-O-Si, Si-OH, etc. on the interface, and silicon It is firmly connected with the glass interface. Compared with other surface bondin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B81C3/00
Inventor 潘明强孙立宁王阳俊刘吉柱陈涛陈立国汝长海王振华
Owner SUZHOU UNIV
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