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Hybrid anodic bonding system and method based on multi-energy field coupling

An anodic bonding and composite technology, which is applied in the photoengraving process of pattern surface, precision positioning equipment, microstructure technology, etc., can solve the problems of strict wet chemical activation process conditions, low bonding efficiency and complex process, etc. Achieve the effect of strengthening the pretreatment discharge effect, improving the bonding quality, and promoting the bonding effect

Active Publication Date: 2016-09-28
SUZHOU UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, high temperature makes anodic bonding prone to the following problems: First, the bonding efficiency is low
However, the current plasma activation environment conditions are strict and require special expensive plasma equipment. The process conditions of wet chemical activation are strict and the process is complicated, resulting in the problems of complex process and poor controllability of these activation methods, which restrict the interface activation composite anodic bonding. Wide application of technology

Method used

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  • Hybrid anodic bonding system and method based on multi-energy field coupling
  • Hybrid anodic bonding system and method based on multi-energy field coupling
  • Hybrid anodic bonding system and method based on multi-energy field coupling

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Embodiment Construction

[0038] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present invention.

[0039] ginseng figure 1 As shown, a kind of composite anodic bonding system based on multi-energy field coupling of the present invention includes:

[0040] A workbench, the workbench includes a first electrode 11 and a second electrode 12 arranged in parallel, and the first electrode 11 and the second electrode 12 are respectively used for placing glass devices and silicon devices;

[0041] The power supply module 20 is electrically conne...

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Abstract

The invention discloses a composite anode bonding system and method based on multi-energy field coupling. It is used to place glass devices and silicon devices; the two ends of the power module are electrically connected to the first electrode and the second electrode respectively; the electromagnetic induction heating device is installed under the second electrode for electromagnetic discharge pretreatment and anodic bonding. Reinforcement; the driving device is connected to the first electrode and is used to drive the first electrode to move up and down. The overall structure of the present invention is simple and easy to integrate; the integrated control of electromagnetic induction heating, pretreatment discharge and anodic bonding is easy to control; the whole composite bonding process is easy to realize, the parameters are easy to adjust, and the bonding performance can be adjusted. Good control.

Description

technical field [0001] The invention relates to the technical field of anodic bonding, in particular to a composite anodic bonding system and method based on multi-energy field coupling. Background technique [0002] Anode bonding technology plays an important role in the production, assembly, packaging and other links of MEMS devices. It is the core technology connecting various silicon processing technologies and the basic means to realize complex MEMS structures such as three-dimensional intersecting structures and multi-layer structures. one. At present, anodic bonding is realized by high temperature (400-500°C) and high voltage (1000-2000V). Physical and chemical reactions occur at the joint interface, which promotes the opening and closing of the chemical bonds formed by -OH, -O, -H, -Si, etc., and re-forms new chemical bonds such as Si-O-Si, Si-OH, etc. on the interface, and silicon It is firmly connected with the glass interface. Compared with other surface bondin...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B81C3/00
Inventor 潘明强孙立宁王阳俊刘吉柱陈涛陈立国汝长海王振华
Owner SUZHOU UNIV
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