Method for producing a support comprising an electronic device
A technology for electronic devices and supports, which is applied in the field of manufacturing supports, can solve problems such as complex implementation and time-consuming, and achieve good printing performance and good contrast
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[0101] figure 1 The method of manufacturing the support 1 according to the first embodiment of the present invention is schematically shown, and the support 1 can be cut into support units.
[0102] Before performing step 100, have figure 2 The first layer 2 shown is formed of a polymer material. In the example shown, the first layer 2 has a core sublayer 3 with voids. For example, the core sublayer 3 has a thickness of 50 μm to 300 μm.
[0103] Such as figure 2 As shown, the first layer 2 may include at least one skin sublayer. In the illustrated example, the first layer 2 includes two skin sublayers, and the core sublayer 3 is sandwiched between the two skin sublayers. For example, layer 2 is made of BM1C or BM type high density polyethylene synthetic paper sold by ARJOBEX. production.
[0104] For example, one skin sub-layer of the first layer 2 is a printing sub-layer 4. For example, the printing sublayer 4 has a thickness of 5 μm to 40 μm, and can be configured to allow c...
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