Supercharge Your Innovation With Domain-Expert AI Agents!

Method for producing a support comprising an electronic device

A technology for electronic devices and supports, which is applied in the field of manufacturing supports, can solve problems such as complex implementation and time-consuming, and achieve good printing performance and good contrast

Inactive Publication Date: 2012-09-12
ARJO WIGGINS SECURITY SAS
View PDF10 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The step involving pre-creating a cavity in the support for insertion of the electronic device may represent a relatively complex and time-consuming implementation

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for producing a support comprising an electronic device
  • Method for producing a support comprising an electronic device
  • Method for producing a support comprising an electronic device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0101] figure 1 A method of producing a support 1 according to a first embodiment of the invention is schematically shown, said support 1 being divisible into support units.

[0102] Before performing step 100, have such as figure 2 Shown is a first layer 2 formed of polymeric material. In the example shown, the first layer 2 has a core sublayer 3 with interstices. For example, the core sublayer 3 has a thickness of 50 μm˜300 ​​μm.

[0103] Such as figure 2 As shown, said first layer 2 may comprise at least one skin sub-layer. In the example shown, said first layer 2 comprises two skin sub-layers between which said core sub-layer 3 is sandwiched. For example, layer 2 is made of BM1C or BM type high-density polyethylene synthetic paper sold by ARJOBEX company production.

[0104] For example, one skin sub-layer of the first layer 2 is a printing sub-layer 4 . For example, the printing sub-layer 4 has a thickness of 5 μm to 40 μm, and can be configured to allow copper...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a method for producing a support comprising at least one electronic device (6), according to which the electronic device (6) is introduced, by means of a grip-release tool, into a first layer (2) of the support, made from at least one polymer material.

Description

technical field [0001] The subject of the invention is a method of manufacturing a support divisible into a set of support units each comprising at least one electronic device, as well as the support itself. Background technique [0002] The invention is applicable to any support made of polymeric material comprising at least one integrated electronic device, especially but not exclusively for the manufacture of security documents such as identity cards or means of payment, Booking receipts (vouchers), gift certificates, game tickets, transport tickets, but also labels or other documents, especially interactive, such as maps, especially road maps. [0003] For example, the support may be cut into a plurality of support units intended to be inserted into the fiber mixture of a paper machine, eg for the manufacture of articles such as security documents or banknotes in particular. Such support units are generally "sheets". [0004] In order to secure documents against forger...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G06K19/077
CPCG06K19/07745H01L2924/0002Y10T156/10Y10T156/1075H01L2924/00
Inventor 辛巴特·勒洛亚勒帕斯卡尔·马林
Owner ARJO WIGGINS SECURITY SAS
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More