Method for producing a support comprising an electronic device
A technology for electronic devices and supports, which is applied in the field of manufacturing supports, can solve problems such as complex implementation and time-consuming, and achieve good printing performance and good contrast
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[0101] figure 1 A method of producing a support 1 according to a first embodiment of the invention is schematically shown, said support 1 being divisible into support units.
[0102] Before performing step 100, have such as figure 2 Shown is a first layer 2 formed of polymeric material. In the example shown, the first layer 2 has a core sublayer 3 with interstices. For example, the core sublayer 3 has a thickness of 50 μm˜300 μm.
[0103] Such as figure 2 As shown, said first layer 2 may comprise at least one skin sub-layer. In the example shown, said first layer 2 comprises two skin sub-layers between which said core sub-layer 3 is sandwiched. For example, layer 2 is made of BM1C or BM type high-density polyethylene synthetic paper sold by ARJOBEX company production.
[0104] For example, one skin sub-layer of the first layer 2 is a printing sub-layer 4 . For example, the printing sub-layer 4 has a thickness of 5 μm to 40 μm, and can be configured to allow copper...
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