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Temperature measurement device and temperature measuring method

A technology of temperature measurement and measurement points, applied in the field of temperature measurement devices, to achieve the effect of high-depth temperature measurement

Active Publication Date: 2015-07-15
SEIKO EPSON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0008] However, when the miniaturization of the temperature measuring part is further promoted, for example, the thermal balance between the side surface of the temperature measuring part and the environment (atmosphere) is very significant, so that the measurement error corresponding to the difference in thermal balance can no longer be ignored.
In this regard, there are undeniably slight measurement errors

Method used

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  • Temperature measurement device and temperature measuring method
  • Temperature measurement device and temperature measuring method
  • Temperature measurement device and temperature measuring method

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Experimental program
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no. 1 Embodiment approach

[0150] figure 1 (A)~ figure 1 (C) is a figure for demonstrating the measuring method of the deep part temperature in 1st Embodiment. in figure 1 Only the essential part (temperature measuring part) of the temperature measuring device in the present embodiment is described in this embodiment. In addition, we will use Figure 8 An example of the overall structure of the temperature measuring device is described.

[0151] First, refer to figure 1 (A). The temperature measuring device in this embodiment has: a substrate 40; a first temperature sensor 50 that measures the temperature at the first measurement point p1 of the substrate 40 as the first temperature Tb; and a second temperature sensor 52 that measures the substrate The temperature at the second measurement point p2 of 40, which is different from the first measurement point p1, is taken as the second temperature Tp; and the ambient temperature acquisition unit 53 which acquires the temperature of the surrounding environmen...

no. 2 Embodiment approach

[0285] In this embodiment, a second calculation formula that is different from the foregoing embodiment is used as the calculation formula of the deep temperature. In addition, in this embodiment, temperature measurement (acquisition of temperature information) is performed at least twice.

[0286] Figure 17 It is a figure for demonstrating the measuring method of the deep part temperature in 2nd Embodiment. Such as Figure 17 As shown, in this embodiment, the first measurement and the second measurement are performed, and the ambient temperature (third temperature) Tout1 in the first measurement is different from the ambient temperature (third temperature) Tout2 in the second measurement.

[0287] Suppose the first temperature obtained in the first measurement is Tb1, the second temperature is Tp1, the third temperature is Tout1, the first temperature obtained in the second measurement is Tb2, the second temperature is Tp2, and the third temperature is Tout2 .

[0288] The calcul...

no. 3 Embodiment approach

[0310] Next, an example of a method of installing the temperature sensor on the base material 40 will be described. Figure 21 (A)~ Figure 21 (E) is a figure for demonstrating an example of the method of providing a temperature sensor on a base material. Here, the first temperature sensor 50 (for example, composed of a thermocouple element) will be described as an example. The method described below is also applicable to the second temperature sensor 52 and the third temperature sensor 55.

[0311] Figure 21 (A) shows a plan view and a cross-sectional view of the base material 40 (including the first temperature sensor 50). As shown in a plan view, the substrate 40 has a square shape in a plan view, and the length Y1 and the width X1 are both 50 mm, for example. In addition, as shown in the cross-sectional view, the height Y3 of the base material is, for example, 5 mm. In addition, the first temperature sensor 50 is embedded in the base 40. The horizontal X2 of the first tem...

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Abstract

A temperature measurement device includes a temperature measurement part, a heat insulator, and a calculation part. The temperature measurement part is disposed among the heat insulator and has a substrate as a heating medium having a first surface as a contact surface configured to contact a measured body, a first temperature sensor configured to measure, as a first temperature, the temperature at a first measurement point of the substrate, and a second temperature sensor for measuring, as a second temperature, the temperature at a second measurement point different from the first measurement point of the substrate. The first measurement point and the second measurement point are positioned on an external surface of the substrate or inside of the substrate. The calculation part calculates a deep temperature in a deep part of the measured body distant from the first surface on the basis of the first temperature and the second temperature.

Description

Technical field [0001] The present invention relates to a temperature measuring device, a temperature measuring method and the like. Background technique [0002] For example, based on body temperature as basic vital information, vital information such as health status, basal metabolic status, and mental status can be obtained. In the case of estimating the health, basal metabolic state, or mental state of a human or animal based on the body temperature of the human or animal, the temperature of the surface part is not required, but information of the temperature of the deep part (deep part temperature) is required. [0003] In addition, for example, in the case of measuring the internal temperature of a furnace or pipe, if the internal temperature (ie, the deep temperature) can be measured by a temperature measuring device installed outside the furnace or pipe, it is not necessary to install the temperature measuring device in The internal engineering of furnaces or pipes will no...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01K7/00G01K13/00
CPCG01K7/42G01K7/427G01K13/002G01K1/165G01K13/20
Inventor 清水兴子
Owner SEIKO EPSON CORP
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