100w 20db attenuating plate with large pad for aluminum nitride ceramic substrate

A technology of aluminum nitride ceramics and aluminum nitride substrates, which is applied to electrical components, circuits, waveguide-type devices, etc., can solve the problems of inability to meet the requirements of attenuation accuracy, deviation of impedance and attenuation accuracy, and poor resistance to high and low temperature shocks. , to achieve the effect of optimizing the circuit design, increasing the pad, and increasing the resistance to high and low temperature shocks

Inactive Publication Date: 2012-10-03
苏州市新诚氏通讯电子股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The above problems are mainly due to the design of the domestic 100W 20dB attenuator, and the high and low temperature impact resistance is poor. After the high and low temperature impact test is completed, the impedance and attenuation accuracy deviate from the actual required range, so that the attenuation accuracy can not meet the requirements

Method used

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  • 100w 20db attenuating plate with large pad for aluminum nitride ceramic substrate
  • 100w 20db attenuating plate with large pad for aluminum nitride ceramic substrate
  • 100w 20db attenuating plate with large pad for aluminum nitride ceramic substrate

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Embodiment Construction

[0017] Preferred embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0018] Such as figure 1 , 2 As shown, the large-pad aluminum nitride ceramic substrate 100W 20dB attenuator includes an aluminum nitride substrate 1, and a conductive layer 5 is printed on the back of the aluminum nitride substrate 1, and the conductive layer is printed by printing silver paste. The front side of the aluminum nitride substrate 1 is printed with resistors R1, R2, R3, R4, R5 and silver paste wire 2, and the silver paste wire 2 connects the resistors R1, R2, R3, R4, R5 to form a TT-shaped attenuation circuit A protective glass film 3 is printed on the resistors R1, R2, R3, R4, and R5, and the protective glass film 3 is used to protect the resistors R1, R2, R3, R4, and R5. Also be printed with one deck black protective film 4 on the upper surface of whole circuit namely silver paste conductor 2 and glass protective film 3, blac...

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Abstract

The invention discloses a 100w 20dB attenuating plate with a large pad for an aluminum nitride ceramic substrate. The attenuating plate comprises an aluminum nitride substrate, wherein the back surface of the aluminum nitride substrate is printed with a conductor layer while the front surface of the aluminum nitride substrate is printed with a plurality of resistors and a silver paste wire, wherein the silver paste wire is connected with the resistors so as to form an attenuating circuit; and a glass protection film is printed on the resistors. The resistor area of the 100w 20dB attenuating plate with the large pad for the aluminum nitride ceramic substrate is increased, so that the property in resisting high-low temperature impact is enhanced and the performance index of the product is qualified; the attenuating plate has higher welding property and stronger welding strength than the current 100w 20dB attenuating plates in the market, due to the large pad design. Meanwhile, the resistors are protected from quenching injury of high temperature when the leads are welded on the output end, so as to avoid the risk that the resistors injured by quenching are likely to break in the practical use; the circuit design is improved and the product can be applied to 3G (third-generation) networks.

Description

technical field [0001] The invention relates to an aluminum nitride ceramic attenuation sheet, in particular to a 100-watt 20dB attenuation sheet for a large pad aluminum nitride ceramic substrate. Background technique [0002] At present, most communication base stations use high-power ceramic load chips to absorb the reverse input power of communication components. High-power ceramic load chips can only simply consume and absorb excess power, but cannot monitor the working conditions of the base station in real time. When the base station fails, it cannot be judged in time, and there is no protection for the equipment. [0003] The attenuator can not only absorb the reverse input power of the communication components in the communication base station, but also extract some signals from the communication components, monitor the base station in real time, and protect the equipment. The attenuation accuracy of ceramic attenuators can only be achieved within 1G frequency, and...

Claims

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Application Information

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IPC IPC(8): H01P1/22
Inventor 陈建良
Owner 苏州市新诚氏通讯电子股份有限公司
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