High-power aluminum nitride ceramic substrate 100 W-27 dB attenuation slice

Abstract

The invention discloses a high-power aluminum nitride ceramic substrate 100 W-27 dB attenuation slice. The attenuation slice comprises an aluminum nitride substrate. A conductor layer is printed on the back surface of the aluminum nitride substrate, a plurality of resistors and silver paste wires are printed on the front surface of the aluminum nitride substrate, the resistors are connected through the silver paste wires to form an attenuation circuit, and glass protection films are printed on the resistors. Due to the fact that the resistor area is increased, the high or low temperature impact resistance of the attenuation slice is improved, and the performance indexes of the attenuation slice meet requirements. Meanwhile, the phenomenon that the resistors are damaged by quenching at a high temperature in the process of welding a lead at the output end is avoided, the risk that the attenuation slice breaks down in the actual use process due to quenching damage of the resistors is avoided, the circuit design is improved, the attenuation precision is improved, and therefore the attenuation slice can be applied to 4G networks.

Description

technical field [0001] The invention relates to an aluminum nitride ceramic attenuation sheet, in particular to a high-power aluminum nitride ceramic substrate 100W-27dB attenuation sheet. Background technique [0002] At present, most communication base stations use high-power ceramic load chips to absorb the reverse input power of communication components. High-power ceramic load chips can only simply consume and absorb excess power, but cannot monitor the working conditions of the base station in real time. When the base station fails, it cannot be judged in time, and there is no protection for the equipment. [0003] The attenuator can not only absorb the reverse input power of the communication components in the communication base station, but also extract some signals from the communication components, monitor the base station in real time, and protect the equipment. However, the current domestic 100W-27dB aluminum nitride The attenuation accuracy of ceramic attenuato...

AI Technical Summary

Problems solved by technology

[0002] At present, most communication base stations use high-power ceramic load chips to absorb the reverse input power of communication components. High-power ceramic load chips can only simply consume and absorb excess power, but cannot monitor the working conditions of the base station in real time. When the base station fails, it cannot make a timely judgment and has no protective effect on the equipment

[0003] The attenuator can not only absorb the reverse input power of the communication components in the communication base station, but also can extract part of the signal in the communication components, monitor the base station in real time, and protect the equipment. However, the current domestic 100W-27dB aluminum nitride The attenuation accuracy of ceramic attenuators can only be achieved within 1G frequency, and a few can achieve 2G, and the attenuation accuracy and the VSWR of the equipment are difficult to control. The market has higher requirements for attenuation accuracy. When or when the VSWR does not meet the requirements, the signal obtained at the output does not meet the actual requirements

When the frequency band is higher than 2G, the attenuation accuracy of domestic attenuators will not meet the requirements

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