Manufacturing method of flexible-rigid circuit board

A soft-hard combination and production method technology, which is applied in the direction of assembling printed circuits with electrical components, can solve the problems of dirty and damaged soft boards and reduce the scrap rate, so as to reduce the scrap rate and ensure the normal operation.

Active Publication Date: 2012-10-03
GUANGZHOU MEADVILLE ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The purpose of the present invention is to provide a method for making a soft-rigid circuit board, which increases the process of sticking tape and tearing tape on the basis of the existing technology, and solves the problem of soft boards caused by broken copper and leaking

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] A method for manufacturing a rigid-flex circuit board, comprising the following steps:

[0022] 1) Soft board graphic production: make graphics on the soft board provided in the soft-hard circuit board;

[0023] 2) Paste the protective film: protect the part of the soft board that needs to be exposed in the finished product of the soft-hard circuit board;

[0024] 3) Punching OPE holes on the soft board: Punch out the alignment holes that need to be used for subsequent lamination with the hard board on the soft board;

[0025] 4) Paste the protective tape: Use laser to burn out the graphic shape of the area to be protected, use manual alignment, paste the protective tape on the soft board, and then press it with a fast press on the dummy paste machine to fix the protective tape;

[0026] 5) Surface treatment of soft board: roughen the copper surface and protective film of the soft board by browning first and then plasma cleaning, so as to enhance the bonding force betw...

Embodiment 2

[0034] A method for manufacturing a rigid-flex circuit board, comprising the following steps:

[0035] 1) Soft board graphic production: make graphics on the soft board provided in the soft-hard circuit board;

[0036] 2) Paste the protective film: protect the part of the soft board that needs to be exposed in the finished product of the soft-hard circuit board;

[0037] 3) Punching OPE holes on the soft board: Punch out the alignment holes that need to be used for subsequent lamination with the hard board on the soft board;

[0038] 4) Paste the protective tape: Use laser to burn out the graphic shape of the area to be protected, use manual alignment, stick the protective tape on the soft board, and then press it with a fast press to fix the protective tape;

[0039] 5) Surface treatment of soft board: roughen the copper surface and protective film of the soft board by browning first and then plasma cleaning, so as to enhance the bonding force between the soft board and the ...

Embodiment 3

[0048] A method for manufacturing a rigid-flex circuit board, comprising the following steps:

[0049] 1) Graphics production of flexible boards: provide graphics materials for flexible boards in the combination of soft and hard circuit boards;

[0050] 2) Paste the protective film: protect the part of the soft board that needs to be exposed in the finished product of the soft-hard circuit board;

[0051] 3) Punching OPE holes on the soft board: Punch out the alignment holes that need to be used for subsequent lamination with the hard board on the soft board;

[0052] 4) Paste the protective tape: Use laser to burn out the graphic shape of the area to be protected, use manual alignment, paste the protective tape on the soft board, and then press it with a fast press on the dummy paste machine to fix the protective tape;

[0053] 5) Surface treatment of soft board: roughen the copper surface and protective film of the soft board by browning first and then plasma cleaning, so a...

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PUM

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Abstract

The invention discloses a manufacturing method of a flexible-rigid circuit board. The manufacturing method comprises the steps of manufacturing a flexible board image, attaching a protective film, punching an OPE hole in the flexible board, attaching a protective adhesive tape, conducting surface treatment on the flexible board, arranging plates, pressing the flexible board and a rigid board, punching a registration hole, manufacturing an outer-layer image and uncovering, and simultaneously tearing off the protective adhesive tape. According to the manufacturing method, in the flexible board manufacturing process, the protective adhesive tape is additionally attached after the protective film is attached and the OPE hole is punched, the protective adhesive tape is torn off in the subsequent uncovering procedure, the problem that the flexible board is stained and broken caused by liquid medicine leakage due to broken copper in the production process of the existing method can be solved, meanwhile, the windowing copper surface of the flexible board area can be protected, the rejection rate is lowered, the normal operation of the work procedures can be ensured, and the thickness of the plate can not be affected.

Description

[0001] technical field [0002] The invention relates to a manufacturing process of a circuit board, in particular to a method for manufacturing a soft-rigid circuit board. [0003] Background technique [0004] With the development of science and technology, more and more electrical devices tend to be miniaturized and ultra-thin, and circuit boards play an increasingly important role accordingly. Rigid-flex circuit boards have both the durability of rigid circuit boards and the adaptability of flexible circuit boards, and their number is increasing year by year. Compared with ordinary circuit boards, rigid-flex circuit boards have the advantages of light weight, thin interlayer, short transmission path, small conduction aperture, less noise, and high reliability. [0005] At present, the production of soft and hard circuit boards is developing in the direction of ultra-thinning. For thinner flexible and rigid circuit boards, single-sided polyimide (PI) copper foil or cop...

Claims

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Application Information

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IPC IPC(8): H05K3/36
Inventor 周咏赵玉梅吴少晖张榕晨
Owner GUANGZHOU MEADVILLE ELECTRONICS
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