A method for manufacturing a rigid-flex circuit board

Abstract

The invention discloses a manufacturing method of a flexible-rigid circuit board. The manufacturing method comprises the steps of manufacturing a flexible board image, attaching a protective film, punching an OPE hole in the flexible board, attaching a protective adhesive tape, conducting surface treatment on the flexible board, arranging plates, pressing the flexible board and a rigid board, punching a registration hole, manufacturing an outer-layer image and uncovering, and simultaneously tearing off the protective adhesive tape. According to the manufacturing method, in the flexible board manufacturing process, the protective adhesive tape is additionally attached after the protective film is attached and the OPE hole is punched, the protective adhesive tape is torn off in the subsequent uncovering procedure, the problem that the flexible board is stained and broken caused by liquid medicine leakage due to broken copper in the production process of the existing method can be solved, meanwhile, the windowing copper surface of the flexible board area can be protected, the rejection rate is lowered, the normal operation of the work procedures can be ensured, and the thickness of the plate can not be affected.

Description

technical field [0001] The invention relates to a manufacturing process of a circuit board, in particular to a method for manufacturing a soft-rigid circuit board. Background technique [0002] With the development of science and technology, more and more electrical devices tend to be miniaturized and ultra-thin, and circuit boards play an increasingly important role accordingly. Rigid-flex circuit boards have both the durability of rigid circuit boards and the adaptability of flexible circuit boards, and their number is increasing year by year. Compared with ordinary circuit boards, rigid-flex circuit boards have the advantages of light weight, thin interlayer, short transmission path, small conduction aperture, less noise, and high reliability. [0003] At present, the production of soft and hard circuit boards is developing in the direction of ultra-thinning. For thinner flexible and rigid circuit boards, single-sided polyimide (PI) copper foil or copper foil is usually...

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a method for making a soft-rigid circuit board, which increases the process of sticking tape and tearing tape on the basis of the existing technology, and solves the problem of soft boards caused by broken copper and leaking liquid medicine in the production process of the existing method. The problem of dirty and damaged boards can be avoided. At the same time, it can protect the copper surface of the window in the soft board area, reduce the scrap rate and ensure the normal progress of the process.