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Light emitting device package including uv light emitting diode

A light-emitting device packaging and light-emitting diode technology, applied in the direction of electric solid-state devices, semiconductor devices, electrical components, etc., can solve the problems of reducing operational reliability, integration efficiency and economic efficiency.

Active Publication Date: 2017-04-12
SUZHOU LEKIN SEMICON CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, UV LEDs generate a large amount of heat while emitting light, which causes defects and reduces operational reliability
In addition, when the package size of UV LEDs is increased to improve heat dissipation efficiency, integration efficiency and economic efficiency are adversely affected

Method used

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  • Light emitting device package including uv light emitting diode
  • Light emitting device package including uv light emitting diode
  • Light emitting device package including uv light emitting diode

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Embodiment Construction

[0023] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings in such a manner that those of ordinary skill in the art to which the present invention pertains can easily realize the technical idea of ​​the present invention. However, this disclosure may be embodied in different forms and should not be construed as limited to the embodiments set forth herein.

[0024] In this specification, when it is described to include (or include or have) some elements, it should be understood that only these elements may be included (or include or have) or other elements may be included (or include or have) if not specifically limited and these components.

[0025] In the drawings, for clarity, anything unnecessary for describing the present disclosure will be omitted, and thicknesses are exaggerated for the purpose of clearly showing layers and regions. Like reference numerals in the drawings refer to like eleme...

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PUM

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Abstract

The present invention provides a light emitting device package including a UV light emitting diode, which includes a ceramic body, an ultraviolet light emitting diode, a supporting member and a glass film. The ceramic body defines a cavity. The ultraviolet light emitting diode is arranged in the cavity. The support member is disposed on the body and surrounds the cavity. The glass membrane is bonded to the support member and covers the cavity. Since the light emitting device package includes a ceramic body to effectively dissipate heat, and the glass film is directly attached to the ceramic body to reduce the number of components, the manufacturing process of the light emitting device package is simplified and its manufacturing cost is reduced.

Description

[0001] Cross References to Related Applications [0002] This application claims priority from Korean Patent Application No. 10-2011-0036931 filed on Apr. 20, 2011, which is hereby incorporated by reference in its entirety. technical field [0003] The present disclosure relates to a light emitting device package including an ultraviolet light emitting diode. Background technique [0004] Light emitting diodes (LEDs) may constitute light emitting sources by using compound semiconductor materials such as GaAs-based materials, AlGaAs-based materials, GaN-based materials, InGaN-based materials, and InGaAlP-based materials. [0005] Such light emitting diodes are packaged as light emitting device packages that emit light beams of various colors. The light emitting device package is used as a light source in various fields for displaying various colors, for example, lighting display, character display, and image display. [0006] In particular, ultraviolet (UV) LEDs emit radiat...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/64H01L33/48
CPCH01L33/486H01L33/58H01L33/62H01L33/641H01L2933/0033H01L2224/48091H01L2224/48227H01L2224/45139H01L2924/00014H01L2924/00H01L33/48H01L33/54
Inventor 郑粹正金炳穆金有东李建教
Owner SUZHOU LEKIN SEMICON CO LTD