Splinter device and method of wafer

A technology of wafers and splits, which is applied in the manufacture of electrical components, semiconductor/solid-state devices, circuits, etc., can solve the problems of low split efficiency, chip crack damage, and unable to adjust the force, and achieve high efficiency and improve the yield.

Active Publication Date: 2012-12-05
HC SEMITEK ZHEJIANG CO LTD
View PDF5 Cites 9 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] When splitting with a splitter, it is necessary to repeatedly hit the riving knife with a hammer, so that the riving knife hits the wafer and then splits the wafer, resulting in a long time for the entire splitting work, low splitting efficiency, and difficulty in large-s

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Splinter device and method of wafer
  • Splinter device and method of wafer

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] see figure 1 , Embodiment 1 of the present invention provides a wafer splitting device, the device includes an ultrasonic transducer 101 for generating ultrasonic waves, and a transmission medium for transmitting ultrasonic waves to wafers W after dicing ( figure 1 not shown in ), and a support 102 for supporting the diced wafer W. Wherein, the ultrasonic transducer 101 and the support member 102 are arranged opposite to each other.

[0028] Wherein, the wafer W after dicing may be a wafer for manufacturing light-emitting diodes, laser diodes, superluminescent light-emitting diodes, and the like. It is known that several chips are grown on the wafer; the splitting operation of the wafer is to split the wafer to obtain several individual chips. The wafer W after dicing is the wafer after the dicing operation is completed. Specifically, the wafer can be diced by using ultraviolet laser or stealth dicing technology. Generally, the ultraviolet laser scribing technology ...

Embodiment 2

[0039] see figure 2 , Embodiment 2 of the present invention provides a wafer splitting device, the device includes an ultrasonic transducer 201 for generating ultrasonic waves, a transmission medium for transmitting ultrasonic waves to the wafer W after dicing, and a support for A support 202 for the wafer W after dicing. Wherein, the transmission medium is a rivet 203 for splitting the wafer W after dicing; the device also includes a horn 204 for adjusting the amplitude of the ultrasonic waves, and an adjustment assembly for adjusting the position of the rivet 203 ( figure 2not shown). Wherein, the ultrasonic transducer 201 is connected with one end of the horn 204 . The other end of the horn 204 is provided on the splitting knife 203 . The rivet 203 is connected with the adjustment assembly and is arranged directly above the support member 202 .

[0040] Wherein, the ultrasonic transducer 201 and the support member 202 are the same as the ultrasonic transducer 101 and ...

Embodiment 3

[0049] Embodiment 3 of the present invention provides a method for splitting a wafer, the method comprising:

[0050] 301 : Contact the diced wafer with an ultrasonic transmission medium.

[0051] Specifically, as described in Embodiment 1 of the present invention, the transmission medium of the ultrasonic wave is a transparent substance, including air, purified water, alcohol, acetone or glass. If air is used as the transmission medium of ultrasonic waves, then only the diced wafers need to be placed in the air. In practical application, since pure water and other substances transmit ultrasonic waves better than air and are transparent, pure water and other substances should be selected as the ultrasonic transmission medium as much as possible.

[0052] 302: Propagate ultrasonic waves to the diced wafers in the transmission medium, so that the diced wafers are split under the action of ultrasonic waves.

[0053] Wherein, the frequency of the ultrasonic waves can be changed ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a splinter device and a method of a wafer and belongs to the field of a semiconductor light-emitting device. The device comprises an ultrasonic transducer for generating an ultrasonic wave, transfer medium for transferring the ultrasonic wave to the scribed wafer, and a support element for supporting the scribed wafer, and the ultrasonic transducer and the support element are arranged oppositely. The method comprises the following steps: enabling the scribed wafer to contact the transfer medium of the ultrasonic wave, and propagating the ultrasonic wave towards the scribed with the wafer in the transfer medium, so that the scribed wafer is split under the action of the ultrasonic wave. Splitting of the wafer is carried out by the splinter device and the method of the wafer; an ultrasonic technology is mainly adopted in splitting, and the splinter device is high in efficiency, short in time and high in yield of a chip.

Description

technical field [0001] The invention relates to the field of semiconductor light emitting devices, in particular to a wafer splitting device and method. Background technique [0002] Wafers are wafers used to make semiconductor light emitting devices. In the manufacturing process of semiconductor light emitting devices, after the wafer growth is completed, the wafer needs to be divided into several chips for subsequent chip packaging process. [0003] Generally, the method for dividing a wafer is to perform a dicing operation on the wafer first, and then perform a splitting operation on the diced wafer. Wherein, the existing splitting operation is usually completed by using a splitting machine. The splitter includes a platform for placing wafers, a riving knife for splitting the wafer, a hammer for striking the riving knife, and a spring for resetting the hammer. Specifically, when using a splitter to split a wafer, the hammer is first energized, and after the hammer is e...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H01L21/302
Inventor 宋超刘榕王江波
Owner HC SEMITEK ZHEJIANG CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap