Thermosetting film forming composition having photo-alignment property
一种光取向性、热固化的技术,应用在光学、滤光片、非线性光学等方向,能够解决不能获得取向性等问题,达到高耐溶剂性的效果
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Embodiment 1~ Embodiment 6 and comparative example 1~ comparative example 3
[0161] Each composition of Examples 1 to 6 and Comparative Examples 1 to 3 was prepared with the composition shown in Table 1, and solvent resistance, orientation, heat resistance, and transmittance were evaluated for each composition.
[0162] [Table 1]
[0163]
[0164] ※The (A) component in Comparative Example 2 is the number of g of the solution of P1
[0165] [Evaluation of solvent resistance]
[0166] After coating each composition of Example 1 to Example 6 and Comparative Example 1 to Comparative Example 3 on a silicon wafer using a spin coater, it was prebaked on a hot plate at a temperature of 80°C for 120 seconds to form a film Coating film with a thickness of 1.1 μm. The film thickness was measured using F20 manufactured by FILMETRICS. This coating film was post-baked on a hot plate at a temperature of 130° C. for 5 minutes to form a cured film with a film thickness of 1.0 μm.
[0167] After immersing this cured film in CHN or NMP for 60 seconds, it was dried...
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