Shielding cover of pump suction port for semiconductor fabrication
A cover and semiconductor technology, applied in the field of cover, can solve problems such as difficult to remove, peel off, affect product yield, etc., to achieve the effect of ensuring service life, ensuring yield, saving time and manpower
Active Publication Date: 2013-01-09
SHANGHAI HUAHONG GRACE SEMICON MFG CORP
View PDF8 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0004] Due to the strong adhesion of some polymers produced in semiconductor manufacturing, these polymers will adhere to various parts of the cavity such as pump suction ports. Expected flaking, which seriously affects product yield
However, this polymer is very difficult to remove and usually needs to be disassembled to clean it thoroughly, but the disassembly of the pump suction port is very complicated
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0025] In order to make the content of the present invention clearer and easier to understand, the content of the present invention will be described in detail below in conjunction with specific embodiments and accompanying drawings.
[0026] figure 2 A cross-sectional view of a semiconductor manufacturing apparatus according to an embodiment of the present invention is schematically shown.
[0027] Such as figure 2 As shown, the semiconductor manufacturing device according to the embodiment of the present invention includes: a turbo molecular pump 3 , a turbo pump valve 2 , and a pump suction port 1 . Wherein, the turbo molecular pump 3 is connected to the pump suction port 1 through the turbo pump valve 2 . It should be noted that only structures related to the present invention are shown in the drawings, while other structures of the semiconductor manufacturing device (such as other structures in the cavity) are omitted.
[0028] Wherein, a pump suction port shielding ...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention provides a shielding cover of a pump suction port for semiconductor fabrication. A semiconductor fabrication device for the semiconductor fabrication comprises a turbo molecular pump, a turbine pump valve and the pump suction port, wherein the turbo molecular pump is connected with the pump suction port through the turbine pump valve; and the shielding cover of the pump suction port is used for covering the pump suction port in a cavity of the semiconductor fabrication device, and the shielding cover of the pump suction port comprises an annular side wall and a sealing ring distributed at the periphery of the annular side wall. According to the invention, the shielding cover of the pump suction port is mounted on the pump suction port, so that polymers are adhered onto the inner wall of the shielding cover of the pump suction port instead of the pump suction port. Thus, the shielding cover of the pump suction port only needs to be taken up and cleaned in the maintaining process, so that the time and labor are saved, and the service life of the turbo molecular pump and the product yield are guaranteed.
Description
technical field [0001] The present invention relates to semiconductor manufacturing processes, and more particularly, the present invention relates to a shielding cover for pump suction ports used in semiconductor manufacturing. Background technique [0002] In semiconductor manufacturing processes, such as metal etching processes, it is necessary to use suitable semiconductor manufacturing devices. figure 1 It schematically shows a partially exploded perspective view of a semiconductor manufacturing device according to the prior art. [0003] Such as figure 1 As shown, the semiconductor manufacturing device includes: a turbo molecular pump 3 , a turbo pump valve 2 , and a pump suction port 1 . Wherein, the turbo molecular pump 3 is connected to the pump suction port 1 through the turbo pump valve 2 . [0004] Due to the strong adhesion of some polymers produced in semiconductor manufacturing, these polymers will adhere to various parts of the cavity such as pump suction ...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Applications(China)
IPC IPC(8): F04D29/52F04D19/04
Inventor 包中诚陈超
Owner SHANGHAI HUAHONG GRACE SEMICON MFG CORP