Molding die for sheet material with reversed bound edge

Abstract

The invention discloses a molding die for sheet materials with reversed bound edges, which comprises an upper die assembly and a lower die assembly; the upper die assembly comprises an upper die base, an upper pressing plate, a pressing spring, an inclined slide block, an inclined punch, a guide block, an upper die spring, a slide block reset spring, and a spring stop; the lower die assembly comprises a lower die base, a lower die plate, a lower die slide block, a lower demolding plate, a lower die spring; the inclined punch has a first inclined guiding surface; the inclined slide block has a second inclined guiding surface; the slide block reset spring is disposed between the spring stop and the inclined slide block, and pushes the second inclined guiding surface to cling to the first inclined guiding surface; at the other side for forming inclined guiding surface, the second the inclined slide block is also provided with a convex particle for forming the reversed bound edge; a groove is formed between the lower die slide block and the lower die plate; when the upper die assembly and the lower die assembly are combined to form a molding cavity, the convex particle is engaged with the groove. The invention can fully automatically realize molding of sheet materials and their reversed bound edge structures, and has the characteristics of simple operation and convenience.

Description

Technical field [0001] The present invention relates to the field of injection molding molds for sheet materials, and more specifically to a forming mold with an over-wrapped sheet material, which can simultaneously mold the over-wrapped sheet material, thereby having the characteristics of high forming efficiency, especially It can be used to form various IMD home appliance panels, IMD laptop shells and IMD mobile phone shells. Background technique [0002] With the increasing popularity of electronic products such as mobile phones, notebooks, and digital cameras, the demand for the housings of the above-mentioned electronic products has also steadily increased. At present, the housings of the above-mentioned electronic products are all processed by injection molding. [0003] However, with the continuous innovation in appearance of the above-mentioned electronic product shells, many shells have turned up, which brings challenges to the injection molding process, especially the in...

AI Technical Summary

Problems solved by technology

[0003] However, with the continuous innovation in the appearance of the above-mentioned electronic product casings, many casings have reversed wrapping, which brings challenges to the injection molding process, especially the injection mold.

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