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Epoxy resin conducting adhesive with high bonding strength

A technology of epoxy resin and conductive adhesive, applied in the direction of epoxy resin adhesive, conductive adhesive, adhesive, etc., can solve problems such as reducing the bonding performance of conductive adhesive

Active Publication Date: 2013-09-25
GUANGZHOU POCHELY NEW MATERIAL TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] However, the commonly used epoxy resin conductive adhesive still has a certain gap with tin-lead soldering in terms of conductivity. If more conductive filler materials are added, the bonding performance of the conductive adhesive will be reduced.

Method used

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  • Epoxy resin conducting adhesive with high bonding strength

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Embodiment Construction

[0019] The components were prepared in the weight ratios shown in Table 1.

[0020] The weight proportion of table 1 embodiment 1~embodiment 3

[0021]

[0022] The above epoxy resin is a 1:3 mixture of epoxy resins E-44 and E-42.

[0023] The metal powder mentioned above is silver powder, and the particle size range of the silver powder is 0.1-0.5 μm.

[0024] The aforementioned solvent is tetraethylene glycol dimethyl ether.

[0025] Above-mentioned surfactant adopts fatty alcohol polyoxyethylene ether.

[0026] The above-mentioned curing agent is preferably dicyandiamide.

[0027] The above-mentioned coupling agent adopts tetraisopropyl titanate.

[0028] The preparation method is:

[0029] S1: Take epoxy resin, acrylate resin, and chlorinated polypropylene, add half of the solvent, and stir evenly;

[0030] S2: In the mixture obtained in S1, while stirring, slowly add metal powder, carbon powder, vanadium pentoxide and carbon fiber, and stir evenly;

[0031] S3: ...

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Abstract

The invention provides an epoxy resin conducting adhesive with high bonding strength, belonging to the field of adhesive technology. The adhesive comprises (by weight parts) 10-20 parts of epoxy resin, 5-10 parts of acrylate resin, 3-8 parts of chlorinated polypropylene, 2-4 parts of vanadium pentoxide, 2-3 parts of diethanolamine, 3-5 parts of benzophenone, 3-5 parts of ethyl acetoacetate, 1-2 parts of 4,4'-diaminodiphenylmethane, 1-3 parts of adipic acid dihydrazide, 1-2 parts of 3,4'-dichlorodiphenyl ether, 5-15 parts of carbon powder, 100-120 parts of metal powder, 5-10 parts of carbon fiber, 15-25 parts of solvent, 2-4 parts of surfactant, 3-6 parts of a coupling agent, and 15-30 parts of a curing agent. The conducting adhesive has volume resistivity below 2.0 milliohm.cm and tensile strength above 15 MPa.

Description

technical field [0001] The invention provides a conductive adhesive, in particular to an epoxy resin conductive adhesive with high bonding strength, which belongs to the technical field of adhesives. Background technique [0002] Conductive adhesive, also known as conductive adhesive, is a special adhesive that is composed of matrix resin, curing agent and conductive filler, which can effectively bond substrate materials and have conductive properties after curing or drying at a certain temperature. Conductive adhesive can be divided into two categories: structural type and filling type according to the composition of the matrix. The structural type refers to the conductive adhesive in which the polymer material itself is conductive as the matrix of the conductive adhesive; the filled type refers to the conductive adhesive that usually uses the adhesive as the matrix and relies on the addition of conductive fillers to make the glue conductive. At present, the preparation of...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/00C09J163/02C09J133/00C09J123/28C09J9/02
Inventor 肖伟荣
Owner GUANGZHOU POCHELY NEW MATERIAL TECH CO LTD
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