The utility model belongs to
chip packaging technical field, specifically disclose a kind of packaging structure of annular integrated passive device, it include: substrate, frame base island, intermediate base island
chip, annular PCB, passive device and outer output pin, the substrate outer surface is arranged frame base island, annular PCB, the outer output pin is arranged in the outermost
peripheral edge of substrate one week, the intermediate base island
chip is attached on frame base island, the passive device is attached on annular PCB, it is connected through wire between the intermediate base island chip and outer output pin, the intermediate base island chip is connected with annular PCB through lead, the passive device includes synchronous passive device, chip level passive device, the synchronous passive device, chip level passive device is attached on annular PCB. It can be contacted by increasing
radio frequency device and base island, guarantee the heat dissipation of product, synchronous integrated passive device chip and passive device, guarantee
radio frequency device
power output and more device integration.