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Integrated circuit layout structure and version control circuit

A technology of integrated circuit and layout structure, applied in the field of layout structure and version control circuit, which can solve the problems of excessive use and increased cost

Active Publication Date: 2015-10-07
REALTEK SEMICON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the end, the number of reticles required to change the version number may be higher than the number of reticles required to fix major bugs
[0003] Therefore, how to propose a novel integrated circuit layout structure and version control circuit for the above problems, which can avoid the use of too many masks and increase the cost when changing the layout structure, so that the above problems can be solved

Method used

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  • Integrated circuit layout structure and version control circuit
  • Integrated circuit layout structure and version control circuit
  • Integrated circuit layout structure and version control circuit

Examples

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Embodiment Construction

[0023] see figure 1 , is a schematic structural diagram of an embodiment of the present invention. As shown in the figure, the layout structure of the integrated circuit of the present invention includes a signal supply unit 10 and at least one transmission unit 20 . The signal supply unit 10 is used to provide a first signal or a second signal, that is, the signal supply unit 10 can receive the first signal or the second signal output by the external circuit, and provide the first signal or the second signal, or the signal supply The unit 10 can generate the first signal or the second signal by itself, and provide the first signal or the second signal, wherein the levels of the first signal and the second signal are different, for example: if the first signal is a high (low) level signal, the second signal is a low (high) level signal. In this embodiment, the signal supply unit 10 further includes a conversion unit 12 . The conversion unit 12 receives the first signal and ...

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PUM

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Abstract

The invention relates to a layout structure of an integrated circuit and a version control circuit. The layout structure comprises a signal supply unit and at least one transmission unit. The signal supply unit is used for providing a first signal and a second signal. Each transmission unit is provided with a plurality of metal layers connected with one another. One of the metal layers receives and transmits the first signal or second signal. When the circuit is revised a plurality of sub-circuits and a signal transmission value are altered, minimum metal layers shared in revising and altering are considered. When the transmission units are changed from transmitting the first signal to transmitting the second signal, the metal layers are interrupted in transmitting the first signal and receive and output the second signal. Therefore, the use number of photo-masks can be decreased effectively, and cost is decreased.

Description

technical field [0001] The present invention relates to a layout structure and a version control circuit, in particular to a layout structure and a version control circuit of an integrated circuit (IC). Background technique [0002] Generally speaking, after the development and design stages of the integrated circuit are completed, the designed integrated circuit is actually manufactured on the chip through the fab. However, in today's increasingly complex chip manufacturing process, very few products are successfully manufactured for the first time, and there is no need to change any circuits afterwards. Most circuits need to be revised repeatedly during the trial production process. In order to save R&D costs, they can be classified as "all layer change" or "metal layer change" when remaking. The former is from the chip substrate. Design changes are made to the photomask of the uppermost metal layer, while the latter only makes design changes to the photomask of the upper...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L27/02H01L23/535
Inventor 邱永明
Owner REALTEK SEMICON CORP
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