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Honeycomb type cooling fin structure

A heat sink, honeycomb technology, applied in the field of honeycomb heat sink structure, can solve the problems of limited surface area, poor heat exchange efficiency, and inability to provide heat dissipation performance of flat heat sink fins 20, so as to improve heat conversion efficiency and high quality Heat dissipation efficiency and the effect of reducing manufacturing cost

Inactive Publication Date: 2013-02-20
KUSN WEISHENG PRECISION HARDWARE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, in this existing heat sink structure, the surface area of ​​the flat heat sink fins 20 is limited, so the heat exchange efficiency with the air is not good, and good heat dissipation performance cannot be provided.

Method used

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  • Honeycomb type cooling fin structure
  • Honeycomb type cooling fin structure
  • Honeycomb type cooling fin structure

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Embodiment Construction

[0029] In conjunction with the accompanying drawings, preferred embodiments of the present invention are described in detail as follows:

[0030] Such as figure 2 The perspective view of the embodiment of the honeycomb fin structure of the present invention, image 3 The side view of the embodiment of the honeycomb fin structure of the present invention and Figure 4 As shown in the schematic diagram of the assembly process of the embodiment of the honeycomb heat sink structure of the present invention, the honeycomb heat sink structure of the present invention includes: a substrate 1 and a plurality of heat dissipation units 2, wherein the substrate 1 has an upper surface 11 and a lower surface 12. The upper surface 11 is provided with a dovetail-shaped joint groove 111, and the plurality of heat dissipation units 2 are composed of a plurality of wave-shaped heat dissipation fins 22 erected equidistantly on a long sheet-shaped base 21, and on the long sheet-shaped base 21 ...

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Abstract

The invention discloses a honeycomb type cooling fin structure which comprises a substrate and a plurality of cooling units. The substrate is provided with at least one combination groove, the plurality of the cooling units are formed by erecting a plurality of wave-shaped cooling fins at intervals on an elongated base, and the plurality of the cooling units are arranged in groups on the at least one combination groove of the substrate in forward and inverse staggering mode, so that the wave-shaped cooling fins are crossed to form a honeycomb shape when observed from a side direction, and accordingly, the cooling fin structure has a large surface area, the thermal conversion efficiency can be improved, and the cooling efficiency is promoted.

Description

technical field [0001] The invention relates to a heat sink structure, in particular to a honeycomb heat sink structure applied to electronic components for taking away the heat generated during operation. Background technique [0002] The current electronic component manufacturing technologies are all developed in the direction of lightness, thinness, shortness, and smallness, and the structural design of electronic equipment is also tending to be compact. The development of this solution will increase the load heat per unit volume, so the most economical cost must be designed The solution is to effectively and quickly dissipate heat to ensure the reliability and service life of electronic components. The most commonly used heat dissipation method for this type of electronic component is to set up a heat sink above it to make the heat generated by the electronic component during operation After being transferred to the heat sink, the heat on the surface of the heat sink is ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/367
Inventor 黄德河
Owner KUSN WEISHENG PRECISION HARDWARE