Heat radiation system for LED (light emitting diode) illumination

A technology of LED lighting and cooling system, applied in lighting and heating equipment, lighting devices, cooling/heating devices of lighting devices, etc., can solve the problems of poor cooling effect of LED lighting cooling system, avoid hard contact and ensure normal operation The effect of temperature on the working environment

Inactive Publication Date: 2014-03-26
SHENZHEN ZHONGJI XINGYE ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The invention designs a LED lighting heat dissipation system, which solves the technical problem that the heat dissipation effect of the existing LED lighting heat dissipation system is not good

Method used

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  • Heat radiation system for LED (light emitting diode) illumination
  • Heat radiation system for LED (light emitting diode) illumination
  • Heat radiation system for LED (light emitting diode) illumination

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Embodiment Construction

[0030] Combine below Figure 2 to Figure 8 , the present invention is further described:

[0031] Such as figure 2 To such as Figure 8 As shown, a LED lighting cooling system includes a lighting unit, a cooling unit, and a control unit. The lighting unit includes an LED fluorescent lamp 1 and a concentrating plate adjustment device 6. The cooling unit includes a temperature sensor and a cooling micro-fan 5. The temperature sensor collects on the circuit board The temperature is sent to the control unit for processing. The control unit controls the number of light-emitting diodes according to the temperature value collected by the temperature sensor and controls the opening of the heat dissipation micro-fan 5 and the condenser plate adjustment device 6. The condenser plate adjustment device 6 drives the condenser plate 63 to Move down and make the condensing plate 63 and the arc-shaped reflector 2 form a heat dissipation channel, and the heat dissipation micro fan 5 blows h...

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Abstract

The invention relates to a heat radiation system for LED (light emitting diode) illumination. The heat radiation system comprises an illumination unit, a heat radiation unit and a control unit. The illumination unit comprises an LED daylight lamp and a light gathering plate adjustment device, the heat radiation unit comprises a temperature sensor and a heat radiation miniature fan, the temperature sensor is used for collecting a temperature of the circuit board and sending the data to the control unit for processing, the control unit is used for controlling the illuminating number of light emitting diodes and starting of the heat radiation miniature fan and the light gathering adjustment device according to the temperature value collected by the temperature sensor, the light gathering plate adjustment device is used for driving a light gathering plate to move downward and enabling the light gathering plate to form a heat radiation passageway with an arc reflecting plate, and the heat radiation miniature fan is used for blowing hot air out of the LED daylight lamp through the heat radiation passageway. Since the position of the light gathering plate is lowered by the light gathering plate adjustment device so as to form the heat radiation passageway, a great amount of heat accumulated in the lamp is exhausted by the heat radiation miniature fan through the heat radiation passageway, and heat radiation on the LED daylight lamp can be effectively controlled.

Description

technical field [0001] The application date of the present invention is June 17, 2011, the application number is: 201110163235.9, and the divisional application of the invention patent application titled "An LED lighting cooling system". The invention relates to a cooling system for lamps, in particular to a cooling system for LED lighting. Background technique [0002] LED is a solid-state semiconductor device that converts electricity directly into light. The heart of LED is the wafer of a semiconductor, and one end of wafer is attached on a bracket, and one end is negative pole, and the other end connects the positive pole of power supply, and whole wafer is encapsulated by epoxy resin. Semiconductor wafer is made up of two parts, and a part is P-type semiconductor, and hole occupies an leading position in it, and the other end is N-type semiconductor, and here mainly is electron. But time these two kinds of semiconductors couple together, between them, just form a P-N ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F21V29/02F21Y101/02F21V29/67F21Y115/10
Inventor 朱朝军冯凌
Owner SHENZHEN ZHONGJI XINGYE ELECTRONICS
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