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Wire saw device

A technology of wire saws and winding tubes, which is applied in the direction of sawing machine devices, fine working devices, metal sawing equipment, etc., and can solve problems such as chip damage

Inactive Publication Date: 2013-03-27
OSUNG LST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the process of cutting the ingot into wafers, the wafers are partially broken due to unevenness in the tension of the wire as the cutting mechanism, etc.

Method used

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Embodiment Construction

[0026] What needs to be explained before the description is that in multiple embodiments, the same symbols are used for the structural elements having the same structure, and a representative description is made in the first embodiment, and in other embodiments the same as the first The different configurations of the embodiments will be described.

[0027] Next, a wire saw device according to a first embodiment of the present invention will be described in detail with reference to the drawings.

[0028] The wire saw device of the first embodiment of the present invention is like a conventional wire saw device, and an ingot is provided inside a chamber of a predetermined size, including a cutting part and a delivery part, through which the wire is supplied to the cutting part and fed from the cutting part. a recovery line, the cutting section moves the ingot downward and cuts the ingot into wafers by the line, the delivery section includes a plurality of rollers on one side of...

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PUM

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Abstract

Apparatus of wire saw ingots to the present invention related to a cut in accordance with the present invention apparatus of wire saw for cutting ingots to move downward in apparatus of wire saw, a plurality of mutually spaced apart rotating bobbin disposed; in the plurality of bobbins multiple round trips are winding wire to cut ingots; the ingot bottom space formed of the plurality of bobbin baskets that are placed in isolation; the insulating bobbin baskets on both sides of the guide plate is coupled to the opposite; characterized in that it contains ingot cutting hereby partially.

Description

technical field [0001] The present invention relates to a wire saw device, and more specifically relates to a wire saw device including a basket capable of receiving chips and the like generated when an ingot is cut with a wire saw. Background technique [0002] Generally, after the growth process of the ingot is completed, a slicing process of cutting the ingot into wafers is performed in order to form the ingot into wafers. [0003] There are many forms of this slicing process, the typical one is the wire saw (Wire Saw), that is, the piano wire or high-tension wire is moved back and forth at high speed in the chamber, and the slurry (slurry) solution is sprayed on it. A method of slicing by friction between the slurry on the wire and the single crystal ingot. [0004] The wire saw method can cut an ingot into multiple wafers at the same time, so that the production yield per unit time can be improved, so it is widely used at present. [0005] Korean Patent No. 887494 dis...

Claims

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Application Information

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IPC IPC(8): B28D5/04B28D7/00
CPCB23D57/003B28D5/0082B28D5/045B28D5/0058
Inventor 张石俊朴泰仁赵昌锡赵商植金海砚郭范锡
Owner OSUNG LST