Amplitude-calibrated 3D-package surface antenna with embedded plated through holes

Abstract

The invention relates to a horn antenna, in particular to an amplitude-calibrated 3D-package surface antenna with embedded plated through holes. The antenna comprises a plated vertical through hole feeder (1), a horn antenna (2) and plated through holes (3), wherein the plated vertical through hole feeder (1), the horn antenna (2) and the plated through holes (3) are integrated on a dielectric substrate (4). The dielectric substrate (4) is arranged at the topmost of 3D package (5). One end of the plated vertical through hole feeder (1) is connected with an internal circuit (8). The horn antenna (2) comprises a bottom metal plane (6), a top metal plane (9) and plated through hole sidewalls (11). The plated through holes (3) form a middle plated through hole array (16), a left plated through hole array (17) and a right plated through hole array (18). Four dielectric loaded waveguides are formed in the horn antenna (2). One end of each dielectric loaded waveguide faces to an antenna narrow-section waveguide short surface (15), and the other end of each dielectric loaded waveguide is close to an antenna aperture surface (12). Aperture efficiency of the amplitude-calibrated 3D-package surface antenna with embedded plated through holes can be improved.

Description

technical field [0001] The invention relates to a horn antenna, in particular to a three-dimensional packaged surface antenna embedded with metallized via holes for amplitude calibration. Background technique [0002] Using micro-assembly technology, a radio frequency system can be integrated in a package, for which the antenna also needs to be integrated on the surface of the package. It is a natural way to integrate a patch antenna on the surface of the package, but the main radiation direction of the patch antenna is the normal direction of the surface, and the main radiation direction we sometimes need is along the surface direction. If the horn antenna is integrated on the surface of the package, the radiation along the surface direction can be realized. However, horn antennas are usually non-planar, incompatible with planar circuit technology, and have large geometric dimensions, which limits their application in packaging structures. In recent years, the substrate-i...

AI Technical Summary

Problems solved by technology

However, the horn antenna is usually non-planar, incompatible with the planar circuit process, and has a large geometric size, which limits its application in the packaging structure

In recent years, the substrate-integrated waveguide horn antenna developed based on substrate-integrated waveguide technology has the characteristics of small size, light weight, and easy planar integration. However, the gain of the traditional substrate-integrated waveguide horn antenna is relatively low. One of the reasons is that the aperture The amplitude of the electromagnetic field on the surface is very uneven, the middle is large and the two sides are small, which affects the radiation performance of the antenna

At present, methods such as dielectric loading and dielectric prisms have been used to correct the asynchronous phase of the horn's aperture surface, but these methods cannot improve the uniformity of the electromagnetic field amplitude distribution on the aperture surface, and these phase alignment structures increase the overall structural size of the antenna. Not suitable for integration into package surface

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