Headphones with built-in equalization

A pressure equalizing device and embedded technology, which is applied in the direction of earpiece/earphone accessories, frequency/direction characteristic devices, etc., can solve the problems of increased earphone distortion and reduced earphone comfort, achieving balanced air pressure and sound pressure, good sound quality, Comfortable to wear

Active Publication Date: 2015-09-09
QINGDAO GOERTEK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Resulting in reduced wearing comfort and increased headphone distortion

Method used

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  • Headphones with built-in equalization
  • Headphones with built-in equalization
  • Headphones with built-in equalization

Examples

Experimental program
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Embodiment Construction

[0014] figure 1 It is a structural schematic diagram of an earphone with an embedded pressure equalizing device of the present invention, figure 2 It is the equivalent circuit diagram of the earphone with embedded pressure equalizing device of the present invention, refer to figure 1 and figure 2 , the earphone with embedded pressure equalizing device of the present invention comprises earphone front shell 2 and earphone rear shell 4, earmuffs 1 are arranged on the outer side of earphone front shell 2, front sound hole 3 is provided on the earphone front shell 2 , the earmuffs 1 and the earphone front shell 2 form a front acoustic cavity, the earphone front shell 2 and the earphone rear shell 4 enclose a rear acoustic cavity, and the earphone front shell 2 and the earphone rear shell 4 enclose a rear acoustic cavity The pressure equalizing cavity 8, the top surface of the equalizing pressure cavity 8 is attached to the inner surface of the earphone front shell 2, and the e...

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PUM

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Abstract

The invention discloses an earphone with an embedded pressure-equalizing device. The earphone comprises a front earphone shell and a rear earphone shell, an earmuff is arranged on the outer side of the front earphone shell, a front sound hole is arranged on the front earphone shell, the earmuff and the front earphone shell enclose a front sound cavity, the front earphone shell and the rear earphone shell enclose a rear sound cavity, a pressure-equalizing cavity body is arranged in the rear sound cavity enclosed by the front earphone shell and the rear earphone shell, the top surface of the pressure-equalizing cavity body is attached onto the inner side face of the front earphone shell, a pressure-equalizing cavity is enclosed between the pressure-equalizing cavity body and the inner side face of the front earphone shell, a first air hole communicated with the pressure-equalizing cavity is arranged on the front earphone shell, and a second air hole communicated with the rear sound cavity is arranged at the position, away from the first air hole, on the bottom surface of the pressure-equalizing cavity body. The earphone with the embedded pressure-equalizing device is capable of equalizing air pressure and sound pressure of the front sound cavity and the rear sound cavity of the earphone, thereby being comfortable for earphone wearing and good in sound quality.

Description

technical field [0001] The invention relates to the technical field of earphones, in particular to an earphone with an embedded pressure equalizing device. Background technique [0002] Existing earphones comprise earphone front shell and earphone rear shell, and earphone front shell is provided with earmuff, and earphone rear shell is closed type or semi-closed type, and earmuff adopts airtight leather earmuff sometimes. For earphones of this structure, pressure is easily generated in the front acoustic cavity formed by combining the earmuffs with the earphone front shell, and in the rear acoustic cavity formed by the combination of the earphone front shell and the earphone rear shell, resulting in sound waves Unable to pass normally and naturally. For example, the sound quality of the earphones is dull and depressing. When the airflow in the front cavity hits the speaker diaphragm and the human eardrum, the diaphragm is deformed by the impact of the strong airflow, result...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H04R1/10H04R1/28
Inventor 林孟钊
Owner QINGDAO GOERTEK
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