Sheet manufacturing apparatus and manufacturing method
A technology of a manufacturing apparatus and a manufacturing method, which is applied to the sheet manufacturing apparatus and manufacturing field, and can solve problems such as poor sticking of the adhesive sheet
Active Publication Date: 2016-09-28
LINTEC CORP
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Problems solved by technology
However, in this case, since the thickness of the release sheet RL at the position where the slit CU is formed becomes too thin, the adhesive sheet may be stuck poorly as follows. And the corresponding part of the release sheet will fall off from the raw material roll RS, or, when the adhesive sheet is peeled off with the release plate, the corresponding part of the release sheet will also be peeled off together with the adhesive sheet, and it will be in a state with the part of the release sheet The adhesive sheet is pasted on the adherend
Method used
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Embodiment Construction
[0018] Embodiments of the present invention will be described below with reference to the drawings.
[0019] In addition, in this specification, unless otherwise specified, terms such as "left", "right", "upper" and "lower" figure 1 as the benchmark.
[0020] exist figure 1 3, the sheet sticking device 10 is configured to include: a table 11 that absorbs and supports the wafer WF and the ring frame RF as an adherend; Move up; Sending unit 14, can send out raw material roll RS, and raw material roll RS is made of strip-shaped sheet RL and the strip-shaped sheet WS temporarily pasted on one side of peeling sheet RL; A slit CU is formed on the strip-shaped sheet WS of the raw material roll RS sent out, an adhesive sheet AS is formed inside the slit CU, and a useless sheet US is formed outside the slit CU; the winding unit 16 can roll the useless sheet US The release plate 18 as a peeling unit folds back the release sheet RL, thereby peeling the adhesive sheet AS from the rel...
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PURPOSE: An apparatus and method for bonding a sheet and an apparatus and method for manufacturing the sheet are provided to form a cut line with a preset depth to correspond to an unbinding direction of an adhesive sheet by performing a cutting operation in a high blade part several times. CONSTITUTION: An unbinding unit unbinds a roll sheet(RS) with a band type sheet(WS) which is temporarily attached to a band type separation sheet. A cutting unit(15) forms a cut line(CU) on the band type sheet and forms an adhesive sheet(AS) in the cut line. The depth of an initial cut line corresponding to an initial separation region is deeper than the depth of the following cut line corresponding to the following separation region. The cutting unit includes a blade(40) with a height in a thickness direction of the band type sheet. The blade includes a high blade part(46) to form the cut line corresponding to a leading tip of the adhesive sheet and a low blade part(48) to form an inner side of the adhesive sheet. A separation plate separates the adhesive sheet from an initial separation region to the following separation region.
Description
technical field [0001] The present invention relates to a sheet manufacturing device and a manufacturing method, and more specifically, to a sheet manufacturing device and a manufacturing method capable of forming an adhesive sheet by forming a cut in a belt-shaped sheet. Background technique [0002] Conventionally, a sheet sticking device for sticking an adhesive sheet on an adherend such as a semiconductor wafer (hereinafter sometimes referred to as "wafer") has been widely used, and a related sheet sticking device is disclosed in, for example, Patent Document 1. . The sheet sticking device of Patent Document 1 is equipped with: a sending unit, which sends out a raw material roll, and the raw material roll is formed by temporarily pasting a strip-shaped sheet on a release sheet; a cutting knife, which forms a closed-loop incision in the process of sending out the raw material roll; peeling off the adhesive sheet formed inside the slit from the peeling sheet; and a pressu...
Claims
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IPC IPC(8): H01L21/683H01L21/67
CPCH01L21/67132H01L21/6836
Inventor 石原崇
Owner LINTEC CORP