Heating element mounting substrate, method of manufacturing the same and semiconductor package

Abstract

A heating element mounting substrate includes a substrate including a first surface and a second surface, a plurality of wiring patterns formed on the first surface of the substrate, and a plurality of filled portions including a conductive material filled in a plurality of through-holes, the plurality of through-holes penetrating through the substrate in a thickness direction. At least one of the plurality of wiring patterns has an area of not less than 30% of an area of the first surface of the substrate. The plurality of filled portions includes non-overlapping portions that extend from the plurality of wiring patterns as viewed from the first surface side of the substrate, areas of the plurality of filled portions overlapped with the plurality of wiring patterns are not less than 50% of respective areas of the corresponding wiring patterns as viewed from the second surface side of the substrate.

Description

technical field [0001] The present invention relates to a heating element mounting substrate for mounting a heating element, a manufacturing method thereof, and a semiconductor package. Background technique [0002] Among heating elements (elements that generate heat), energy saving and CO reduction have recently been 2 From the point of view of LED (Light Emitting Diode, light-emitting diode) component attention has increased. In particular, flip-chip LED elements in which all electrodes are placed on the same surface can exclude electrodes and metal wires from the main light-emitting surface side, so it is believed to be beneficial to improve luminous efficiency (1m / W), and thus attracts a lot of attention . In this flip-chip LED element, it is important to effectively remove heat generated during light emission to prevent an excessive rise in element temperature in order to suppress an increase in heat loss of the element and to prevent a decrease in luminous efficiency...

AI Technical Summary

Problems solved by technology

[0007] (2) High wiring processing costs

At this time, there is a restriction that the thickness of the copper in the portion that conducts heat horizontally cannot be made in order to form a fine pattern, and the distance from the electrode to the via hole is usually longer than the height of the via hole. Compared with the case where the filled via hole with a diameter of 0.08mm or more is arranged directly under the electrode of the flip-chip LED element, the thermal resistance becomes larger

[0011] (3) Reduced versatility of design

[0014] In the case of Patent Document 2, one through hole can be made larger, but it is difficult to make the interval between the through holes 200 μm or less, so the finer the electrode arrangement of the flip-chip LED element, the more difficult it is to deal with it.

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