Heat dissipation structure and electronic apparatus

A technology of heat dissipation structure and electronic components, which is applied in the direction of electrical equipment structural parts, electrical components, cooling/ventilation/heating transformation, etc., which can solve the problems of shortened service life of electronic components, failure of electronic components, and influence on electronic components that do not generate heat and other problems, to achieve the effect of temperature rise suppression

Inactive Publication Date: 2013-04-17
SONY CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Meanwhile, in addition to electronic components that generate heat when driven, electronic components that do not generate heat when driven may be mounted on the circuit board, so there is a thermal adverse effect of the electronic components that generate heat on the circuit board. P...

Method used

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  • Heat dissipation structure and electronic apparatus
  • Heat dissipation structure and electronic apparatus
  • Heat dissipation structure and electronic apparatus

Examples

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Embodiment Construction

[0065] Preferred embodiments of the heat dissipation structure and the electronic device according to the present disclosure are described below with reference to the accompanying drawings.

[0066] The following preferred embodiments relate to the electronic device of the present disclosure applied to a disc recording and reproducing device and the heat dissipation structure of the present disclosure applied to a heat dissipation structure provided in the disc recording and reproducing device.

[0067] In addition, the application range of the electronic device and the heat dissipation structure according to the present disclosure is not limited to the disc recording and reproducing device and the heat dissipating structure provided in the disc recording and reproducing device. The electronic device of the present disclosure can be widely applied to various other electronic devices such as recording and reproducing devices using recording media other than disk recording and re...

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Abstract

A heat dissipation structure includes a circuit board that is disposed inside an outer casing having a chassis formed with air inlet holes, and in which a first electronic component generating heat when driven and a second electronic component not generating heat when driven are mounted on one surface of a base plate, and a heat sink that releases the heat generated in the first electronic component. Here, in the heat sink, a heat dissipation unit positioned facing the base plate, an eaves portion protruding from the heat dissipation unit, and a pair of enclosing portions protruding from ends of the eaves portion in a direction perpendicular to a protruding direction from the heat dissipation unit, and at least one of the air inlet holes is formed in a position facing the eaves portion.

Description

technical field [0001] This disclosure relates to the technical fields of heat dissipation structures and electronic equipment. Specifically, the present disclosure relates to suppressing temperature rise of a second electronic component that does not generate heat when driven without causing Technology that increases production costs. Background technique [0002] There are many cases where a circuit board formed with a predetermined wiring pattern inside a housing is provided in various electronic devices such as recording medium recording and reproducing devices, audio recording and reproducing devices, cellular phones, image recording and reproducing devices, imaging devices, information processing devices , network communication equipment, etc. [0003] There are currently electronic components having various functions that are mounted on such circuit boards and generate heat when driven. Since there is a possibility that the heat generated in the electronic part adv...

Claims

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Application Information

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IPC IPC(8): H05K7/20
CPCH05K7/20145
Inventor 香山俊清水有希子
Owner SONY CORP
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