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Solder ball printing apparatus

A technology of solder balls and supply parts, applied in the direction of tin feeding devices, auxiliary devices, welding equipment, etc., can solve problems such as difficult to supply in any amount, blockage of granular materials, reduction of measurement accuracy, etc., and achieve the effect of avoiding large-scale

Inactive Publication Date: 2013-05-01
HITACHI LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, if it is used for high-precision metering, it is necessary to rotate the light machine at a low speed. In this case, there is a possibility that the granular material will be clogged in the middle of the flow path, and sufficient supply and discharge will not be possible.
In order to solve this problem, if the light machine is rotated at high speed, the measurement accuracy will decrease
In addition, in one rotation operation, only the amount of solder balls determined by the shape of the flow path can be supplied, and it is difficult to supply an arbitrary amount corresponding to the printing medium.

Method used

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Embodiment Construction

[0026] Hereinafter, the present invention will be described using the drawings. figure 1 The overall structure of the solder ball printer of the present invention is shown. figure 1 (a) represents the state before filling the solder balls, figure 1 (b) shows the state where solder balls are being filled. figure 2 It shows the state separated from the mask surface in the configuration diagram of the head portion for solder ball printing. image 3 It is a figure which shows the state which the solder ball supply part contacted with the mask surface. Figure 4 It is a figure which shows the state which supplies a solder ball from a solder ball supply part to a mask surface.

[0027] Such as figure 1 As shown, the solder ball printing machine 1 is provided with a support 2 , and a moving beam 10 for the solder ball filling head 3 to move horizontally on the surface of the mask 12 is arranged on the upper part of the support 2 . The head table 8 provided with the solder ball ...

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Abstract

The present invention discloses a solder ball printing apparatus for supplying solder balls to a mask surface in an appropriate amount and preventing solder ball wastage as possible. In the invention, the solder ball printing apparatus is provided with a mask and a solder ball filling head. The mask prints solder balls on electrodes which are formed on a substrate that is carried on the printing worktable. The solder ball filling head is provided with a vertical driving mechanism that vertically moves on the mask surface. The solder ball printing apparatus is characterized in that: the solder ball filling head is composed of a solder ball filling part and a solder ball supplying part; the solder ball filling head is provided with the vertical driving mechanism which cause the solder ball filling part and the solder ball supplying part to vertically move simultaneously and a supplying part driving mechanism that causes the solder ball supplying part to move vertically; a static-resistant pipe is used for connecting a syringe for storing the solder balls with the solder ball filling part in the solder ball supplying part; and through action of the supplying part driving mechanism, the static-resistant pipe is extended or bent, thereby supplying the solder balls or stopping.

Description

technical field [0001] The present invention relates to a printer for supplying solder balls onto electrodes of a semiconductor substrate, and more particularly to a solder ball supply device including a solder ball supply unit that supplies solder balls to a filling head. Background technique [0002] An example of a conventional solder ball printing machine is described in Patent Document 1. In the printing machine described in this publication, in order to uniformly disperse solder balls on the mask surface with a simple structure and fill them into the openings of the mask, the solder ball supply head includes a solder ball storage section for storing solder balls. A solder ball supply unit that supplies a predetermined amount of solder balls to the mask surface under the solder ball storage unit. The solder ball supply head is made to further have a solder ball filling part, and the solder ball filling part is provided in plurality through the solder ball supply part, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/48
CPCB23K1/0016B23K1/203B23K3/0623B23K3/082H05K3/3478
Inventor 五十岚章雄水鸟量介桥本尚明三本胜本间真
Owner HITACHI LTD
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