Lens module

A lens module and lens component technology, applied in the field of cameras, can solve the problem that the height of the lens component does not meet the needs of market development, etc.

Inactive Publication Date: 2013-06-19
NANCHANG O FILM OPTICAL ELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, with the development trend of thinning existing electronic products, the height...

Method used

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Embodiment Construction

[0017] Please refer to figure 1 and figure 2 , this embodiment discloses a lens module 100 , including a flexible circuit board 110 , a reinforcement board 120 , a sensor 130 and a lens assembly 140 . The flexible circuit board 110 has a mounting surface 112 , a back surface 114 opposite to the mounting surface 112 , and a through hole 116 passing through the mounting surface 112 and the back surface 114 . The reinforcing plate 120 is mounted on the back surface 114 and covers the through hole 116 . The sensor 130 is installed on the reinforcement board 120 and received in the through hole 116 , and the lens assembly 140 is installed on the installation surface 112 of the flexible circuit board 110 . The through hole 116 absorbs part of the height of the sensor 130 , so that the height of the lens module 100 is at least reduced by the thickness of the flexible circuit board 110 , thereby realizing thinning of the lens module 100 .

[0018] In detail, the sensor 130 is past...

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Abstract

The invention provides a lens module. The lens module comprises a flexible circuit board, a reinforcing plate, a sensor and a lens assembly, wherein the flexible circuit board is provided with a mounting surface, a back opposite to the mounting surface and a through hole penetrating through the mounting surface and the back; the reinforcing plate is arranged on the back and covers the through hole; the sensor is arranged on the reinforcing plate and accommodated in the through hole; and the lens assembly is arranged on the mounting surface of the flexible circuit board. The through hole absorbs partial height of the sensor, so that at least the thickness of the flexible circuit board is reduced from the height of the lens module, and the lens module is thinned.

Description

technical field [0001] The invention relates to the field of cameras, in particular to a lens module. Background technique [0002] Many existing electronic products are equipped with lens modules. A general lens module includes a circuit substrate, a sensor assembled on the circuit substrate, and a lens assembly installed on the circuit substrate. The height of the lens module is the sum of the heights of the circuit substrate, the sensor and the lens assembly. However, with the development trend of thinning existing electronic products, the height of the above-mentioned layered lens components obviously does not meet the needs of market development. Contents of the invention [0003] Based on this, a thinner lens module is provided. [0004] A lens module, including a flexible circuit board, a reinforcement board, a sensor and a lens assembly, the flexible circuit board has a mounting surface, a back surface opposite to the mounting surface, and a through hole passing ...

Claims

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Application Information

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IPC IPC(8): G02B7/02H04N5/225
Inventor 曾广锋龚礼宗刘燕妮齐书卢江
Owner NANCHANG O FILM OPTICAL ELECTRONICS TECH CO LTD
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