Electronic component, circuit board, electronic apparatus, and method for manufacturing electronic component
A technology for electronic parts and manufacturing methods, applied in the field of manufacturing electronic parts, circuit substrates, electronic instruments and electronic parts, can solve the problems of difficulty in thinning and miniaturization, achieve thinning, improve freedom, and improve The effect of driving electronic components
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 Refer to the following figure 1 The first embodiment of the electronic component of the present invention will be described. In this embodiment, the case where an electronic component is used in a surface acoustic wave device will be described as an example, and the case where an electronic component is used in a surface acoustic wave device will be described as an example. In the following description, a surface acoustic wave element is appropriately referred to as a "SAW (Surface Acoustic Wave) element" and a surface acoustic wave device is referred to as a "SAW package".
 figure 1 Among them, the SAW package 1 is equipped with: a semiconductor substrate 10 composed of a silicon substrate; a SAW element 50 provided on the first surface 10A side of the semiconductor substrate 10; Penetrating electrode 12 penetrating through surface 10B. The SAW element 50 is provided on the first surface 10A of the semiconductor substrate 10 . The SAW element 50 includes a ...
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