Supercharge Your Innovation With Domain-Expert AI Agents!

Front opening unified pod with latch structure

一种前开式晶圆盒、晶圆的技术，应用在连接构件、包装物品类型、特殊包装物件等方向，能够解决前开式晶圆盒冲击、顶面破损、大型晶圆片裂损等问题，达到避免震动及碰撞、防止尘埃的效果

Inactive Publication Date: 2013-06-19
GUDENG PRECISION IND CO LTD
View PDF7 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The large front-loading wafer box, because it contains large wafers, will be heavier in total weight than the general small wafer box. For example, if the general top-type lifting head C is used, it is locked with multiple locking pieces in the center. Due to the load of the large front-loading wafer cassette and the weight of the wafers inside the top-type lifting transfer head C, the top surface of the front-loading wafer cassette is easily deformed or even damaged. The front opening wafer box is separated and dropped and damaged, resulting in greater cost loss
[0009] In addition, when manually handling a large front-loading wafer cassette, move the front-loading wafer cassette with the opening facing upwards. The front-loading wafer cassette is placed in the plane process, because of the weight of the large wafer inside, It is easy to cause considerable impact between the front opening wafer box and the plane, resulting in cracking or chipping of large wafers due to the impact

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Front opening unified pod with latch structure
  • Front opening unified pod with latch structure
  • Front opening unified pod with latch structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0120] In order to have a further understanding and understanding of the structural features and the achieved effects of the present invention, preferred embodiments and detailed descriptions are used, which are described as follows:

[0121] Because the present invention discloses a wafer cassette, especially a wafer cassette with calibrated supports; some of the wafer cassette manufacturing, cassette material, and through hole correction methods used therein are based on existing Technology to achieve, so in the following description, not a complete description. In addition, the drawings in the following text are not completely drawn based on actual relevant dimensions, and their function is only to express schematic diagrams related to the features of the present invention.

[0122] First, see figure 2 , Is a schematic diagram of a box body of a front-opening wafer box according to an embodiment of the present invention. Such as figure 2 As shown, the front-opening wafer box ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A Front Opening Unified Pod (FOUP) has a pair of latch structures, and the latch structures install in a door of the FOUP. The latch structures use a circular rotary turntable to drive a pair of sliding devices, let the latch structures can lock or unlock more stabilized, and use sliding rollers respectively disposed on the sliding devices to prevent the generation of dusts.

Description

Technical field [0001] The present invention relates to a front-opening wafer box, in particular to a front-opening wafer box equipped with a latch structure. Background technique [0002] Semiconductor wafers have many procedures or steps in the manufacturing process, and wafers need to be placed in different locations and different machines due to these procedures or steps. Therefore, the wafers must be transported from one place during the process. To another place, it must even be stored for a period of time to match the necessary process. Among them, the wafer carrier device (Cassette) has both storage and transportation functions, and needs to be suitable for various forms of transportation and transfer devices, so it plays an extremely important role in the semiconductor wafer manufacturing process. [0003] Such as figure 1 As shown, figure 1 It is a general front opening unified pod (FOUP). The wafer box is usually integrated by injection molding. It has a box body A, and...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/673
CPCH01L21/67369H01L21/67373H01L21/67379H01L21/67386H01L21/67393Y10T292/0834Y10T292/0964H01L21/673B65D85/38B65D85/00
Inventor 王建峰邱铭隆吕绍玮徐子正
Owner GUDENG PRECISION IND CO LTD
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com