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Measuring device and method for measuring thickness of film

A measuring device and thin-film technology, applied in measuring devices, mechanical thickness measurement, instruments, etc., can solve the problems of inaccurate judgment, increased manufacturing cost, and damage to the target structure, and achieve non-destructive, simple method, and low cost Effect

Active Publication Date: 2016-03-23
MACRONIX INT CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Measuring the thickness of the outer edge of the target is still not enough to infer the overall consumption, so it is impossible to accurately judge when to replace the new target and monitor the process
However, using the general method to measure the thickness distribution of the target must destroy the structure of the target, so that the target cannot be used again, which increases the manufacturing cost

Method used

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  • Measuring device and method for measuring thickness of film
  • Measuring device and method for measuring thickness of film

Examples

Experimental program
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Effect test

no. 1 example

[0032] figure 1 A three-dimensional perspective view of the measuring device in the first embodiment is shown. The measuring device may include a seat 2 including a first placement element 4 and a second placement element 6 adjacent to each other. The first placement element 4 and the second placement element 6 can be arranged substantially perpendicular to each other.

[0033] The measuring element 8 is arranged on the first mounting element 4 . The test structure 10 is arranged on the second mounting element 6 . The fixing element 12 can be fixed on the second installation element 6 for locking the position of the test structure 10 on the second installation element 6 so as not to move.

[0034] The measuring element 8 may include a first sliding joint 14 such as a slider, and a first moving part 16 and a second moving part 18 adjacent to each other. The first sliding connection 14 is fixed on the first mounting element 4 . The first moving member 16 includes a second s...

no. 2 example

[0040] figure 2 A three-dimensional perspective view of the measuring device in the second embodiment is shown. The difference between the measuring device in the first embodiment and the measuring device in the second embodiment is that the third sliding part 122 of the second moving part 118 is fixed to the first moving part 116 of the first moving part 116 by using the locking element 130 . Two sliding joints 120, so that the third sliding joint 122 of the second moving member 118 cannot move along the second direction (such as substantially the Z-axis direction), that is, the third sliding joint 122 of the second moving member 118 It is fixed at a specific position in the Z-axis direction. figure 2 The depth gauge in the 140 is replaced by figure 1 The contact part 24 in. The depth gauge 140 includes a casing 142 and a pressing pin 144 passing through the casing 142 . Depth gauge 140 may also be referred to as a dial gauge and may be an electronic or mechanical instr...

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Abstract

The invention discloses a measuring device and a method for measuring film thickness. The measuring device is used for measuring the thickness of a test structure and comprises a measuring element. The measuring element is used for measuring the thickness of the test structure while contacted with the upper surface of the test structure. By utilizing the measuring device and the method for measuring the film thickness, a target material can be utilized in a process again after the thickness is measured, a thickness result helps an operator to learn the consuming condition of the target material and process stability and judge whether the process is changed or not so as to monitor the process in real time. In addition, the method for measuring the film thickness is simple and low in cost and is not destructive.

Description

technical field [0001] The invention relates to a measuring device and a method for measuring the thickness of a thin film, in particular to a measuring device and a method for measuring the thickness of a thin film applied in the semiconductor field. Background technique [0002] In some cases it is necessary to measure the thickness of a test structure such as a block at different locations. Especially when measuring the thickness of the non-outer edge of the test structure, that is, the inner part, it is often necessary to cut the test structure to expose the inner part of the test structure to facilitate thickness measurement. [0003] For example, in the semiconductor process, after a period of use of the sputtering target, the surface of the sputtering target does not appear flat, on the contrary, the thickness of different positions has ups and downs. Measuring the thickness of the outer edge of the target is still not enough to infer the overall consumption, so it i...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01B5/06G01B21/08
Inventor 刘金元
Owner MACRONIX INT CO LTD