Manufacturing method of high multi-level HDI printed circuit board

Abstract

The invention provides a method for manufacturing a high-level multi-stage HDI printed circuit board. According to the number of layers of the product and the number of stacked blind holes, the engineering pre-designs the stacked structure, and at the same time combines the pressing times and material characteristics to predict the expansion and contraction coefficient of the core board. Compensation, systematized design of different graphic layers and production positioning reference points required alignment reference target coordinates, shape, size and process alignment methods, etc., to achieve alignment matching between different layers and different constituent elements It also takes into account the alignment problems of various factors that will appear in the production process of the third-order HDI printed circuit board, and solves the inner layer graphics, sub-outer layer circuits, Alignment problems between a series of key PCB processes such as sub-outer buried holes, outer layer circuits, mechanical through holes, laser blind holes, and solder mask, while ensuring the stacking accuracy of micro-blind holes and the alignment of blind holes, through holes and Alignment accuracy matching of line graphics.

Description

technical field [0001] The invention relates to the fields of printed circuit board (PCB) engineering design and production process, in particular to a method for manufacturing a high-level multi-level HDI printed circuit board. Background technique [0002] With the current trend of continuous and rapid miniaturization, portability and multi-functionalization of electronic products, and the development of high-density mounting technology, the industry has increasingly put forward higher requirements for the carrier and connector printed circuit board as the original component. , so that it can become an electronic component with high density, high precision, and high reliability that can greatly increase the assembly density. Therefore, the high density interconnection (high density interconnection, HDI) applied to the new PCB process technology is widely used in various electronic products, and the application range of the HDI board technology is becoming wider and wider. ...

AI Technical Summary

Problems solved by technology

[0004] The technical problem mainly solved by the present invention is that the existing high-level multi-level HDI printed circuit board manufacturing method causes defects such as partial hole, pattern shift, blind hole stacked hole misalignment, blind / through hole and circuit pattern expansion and contraction inconsistency, etc.

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