Processing method of anti-interference 5G base station signal amplifier printed circuit board

A signal amplifier and printed circuit board technology, applied in multi-layer circuit manufacturing and other directions, can solve problems such as large alignment difficulty, removal, and core board displacement, etc., to ensure stacking accuracy, reduce stacking difficulty, Guaranteed effect of lamination

Pending Publication Date: 2022-04-05
江西中络电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, after the above-mentioned preparation method is actually used by those skilled in the art, it is found that there are still some shortcomings. The more obvious one is that due to the large number of core boards, it is difficult to align them when they are stacked. Put the stacked core boards into the laminator for lamination, which will cause the stacked core boards to easily shift during the process of being put into the laminator, which will affect the subsequent laminated products Pass rate
[0005] In view of the above situation, those skilled in the art thought of setting up a stacking and straightening seat for calibrating the core boards when the core boards are stacked. In the subsequent lamination operation, the stacked orthotics cannot be removed without affecting the core board, and direct lamination without removing the stacked orthotics will cause the core board to be unable to be laminated directly due to the obstruction of the stacked orthotics The hot platen of the machine is in contact, which makes the actual lamination effect not ideal

Method used

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  • Processing method of anti-interference 5G base station signal amplifier printed circuit board
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  • Processing method of anti-interference 5G base station signal amplifier printed circuit board

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Effect test

Embodiment 1

[0036] The present invention provides such Figure 1-4 A processing method of an anti-jamming 5G base station signal amplifier printed circuit board is shown, the processing method is realized by stacking the rectifying seat, and the stacking rectifying seat includes a base plate 1, and the center of the top of the base plate 1 is provided with a second A through groove 2 and the four sides of the top of the base plate 1 are provided with an elevating positioning mechanism 3, the outside of the elevating positioning mechanism 3 is provided with a trigger driving mechanism 4 and the bottom of the elevating positioning mechanism 3 is provided with a lower limit mechanism 5, so When the inner positioning plate 34 in the lifting positioning mechanism 3 descends along the lifting chute 32 in the lifting positioning mechanism 3, it drives the limit slider 37 in the lifting positioning mechanism 3 to the lifting pressure plate in the trigger driving mechanism 4. 44 is pressed down, s...

Embodiment 2

[0044] Described processing method specifically comprises the following steps:

[0045] S1. Use TG170 material core board to make L1 and L2 layers, use ROGERS material core board to make L3 to L(N-2) layers, and use TG170 material core board to make L(N-1) and LN layers;

[0046] S2. Perform pre-process treatment on layers L3 to L(N-2), including cutting, baking plate, inner layer wet film, inner layer etching and internal inspection;

[0047] S3. Stack L3 to L(N-2) layers, and place them on the inside of the four lifting positioning mechanisms 3 on the top of the base plate 1. At this time, the four limit blocks 52 block the bottom L3. An outer positioning plate 31 cooperates with four inner positioning plates 34 to position the stacked L3 to L(N-2) layers;

[0048] S4. Place the stacking and straightening seat carrying layers L3 to L(N-2) on the fixed heat platen inside the laminator, and then start the laminator. Pressing plate begins to descend, and along with the contin...

Embodiment 3

[0054] The difference from the above-mentioned embodiment is that, if figure 2 and Figure 5 As shown, the stacking orthopedic seat also includes an adjustment mechanism 6, the adjustment mechanism 6 is located outside the trigger drive mechanism 4, and the adjustment mechanism 6 includes a mounting plate 61, a draw bar 62, a fourth return spring 63, a handle 64, The fifth return spring 65 and the extension rod 66 .

[0055] More specifically, the mounting plate 61 is fixedly arranged on the top of the base plate 1, the traction rod 62 runs through the mounting plate 61 in the horizontal direction and is slidably connected with the mounting plate 61, and the inner end of the traction rod 62 is connected to the outer positioning plate 31 Fixed connection and the outer end of the draw bar 62 is connected to the handle 64 through the bearing rotation, the fourth return spring 63 is sleeved on the outside of the draw bar 62, and one end thereof is fixedly connected to the mounti...

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Abstract

The invention discloses a processing method of an anti-interference 5G base station signal amplifier printed circuit board, and relates to the technical field of printed circuit boards, the processing method is realized through a stacking correction seat, and the stacking correction seat comprises a base plate. A first through groove is formed in the center of the top of the base plate, lifting type positioning mechanisms are arranged on the four edges of the top of the base plate, trigger type driving mechanisms are arranged on the outer sides of the lifting type positioning mechanisms, and lower end limiting mechanisms are arranged at the bottoms of the lifting type positioning mechanisms. The stacking difficulty of the core plates can be effectively reduced, meanwhile, the stacking accuracy of the core plates can be guaranteed, the displacement phenomenon of the core plates is avoided, meanwhile, in the core plate laminating process, the movable hot pressing plate and the fixed hot pressing plate cannot be blocked, and the actual laminating effect is guaranteed.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a processing method for an anti-jamming 5G base station signal amplifier printed circuit board. Background technique [0002] With the advent of the 5G high-speed communication era, various types of high-frequency circuits, including high-frequency high-speed power amplifiers, require appropriate printed circuit board materials as the basis, so the demand for new high-speed printed circuit boards in the 5G era is increasing. Under the various frequencies of 5G applications, the material manufacturing process and product yield of circuit boards face new challenges. [0003] The invention patent of patent application publication number CN 110831355 B discloses a method for preparing a 5G base station coupler printed circuit board. The preparation method is used to prepare an N-layer high-frequency HDI board for a millimeter wave power amplifier of a 5G base station, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/46
Inventor 沈方斌王小亮陈志安袁锋
Owner 江西中络电子有限公司
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